Patent classifications
B29C41/24
Film capacitor, film-capacitor film, and method for manufacturing film-capacitor film
A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.
Method of producing non-woven protein fibers
The invention relates to non-woven protein fibers and to methods for forming and producing the same. In certain embodiments, the invention provides a method of processing a protein comprising dissolving a protein in a solution, optionally removing any insoluble materials from the solution, and spraying the solution under an applied pressure. In other embodiments, the protein can be derived from a range of sources, including but not limited to arthropod silks, animal keratin (e.g. hair and wool), tissue elastin, collagen, resilin, and plant protein. In certain embodiments, the methods of the invention are an alternative to electrospinning methods known in the art.
METHOD FOR PREPARING MICROGROOVE ARRAY SURFACE WITH NEARLY CYLINDRICAL SURFACE BASED ON AIR MOLDING METHOD
The present invention provides a method for preparing a microgroove array surface with a nearly cylindrical surface based on an air molding method, and relates to the technical field of functional surface preparation. The method includes the following steps: (1) preparing a microgroove array surface, uniformly spreading a layer of a liquid polymer film to be formed on the auxiliary plate, and placing a spacer block in an empty position on the microgroove array surface; (2) placing the auxiliary plate spread with the liquid polymer film on the spacer block on the microgroove array surface, maintaining this state, and feeding the auxiliary plate into a vacuum drying oven; and (3), setting a pressure in the vacuum drying oven according to a designed pressure, heating and solidifying the liquid polymer film, and separating the microgroove array surface to obtain the microgroove array surface with the nearly cylindrical surface.
METHOD FOR PREPARING MICROGROOVE ARRAY SURFACE WITH NEARLY CYLINDRICAL SURFACE BASED ON AIR MOLDING METHOD
The present invention provides a method for preparing a microgroove array surface with a nearly cylindrical surface based on an air molding method, and relates to the technical field of functional surface preparation. The method includes the following steps: (1) preparing a microgroove array surface, uniformly spreading a layer of a liquid polymer film to be formed on the auxiliary plate, and placing a spacer block in an empty position on the microgroove array surface; (2) placing the auxiliary plate spread with the liquid polymer film on the spacer block on the microgroove array surface, maintaining this state, and feeding the auxiliary plate into a vacuum drying oven; and (3), setting a pressure in the vacuum drying oven according to a designed pressure, heating and solidifying the liquid polymer film, and separating the microgroove array surface to obtain the microgroove array surface with the nearly cylindrical surface.
Super Absorbent Polymer Film and Preparation Method Thereof
The present disclosure relates to a super absorbent polymer film and a preparation method of the same. Specifically, it relates to a new type of super absorbent polymer film, which is thin and exhibits excellent absorption performance and high tensile strength. In addition, the super absorbent polymer film of the present disclosure is free from scattering or leaking, and does not require an auxiliary substance such as pulp, so that products can be made thinner and the manufacturing process and costs may be reduced.
Water-soluble film, chemical agent package, and method of producing water-soluble film
A water-soluble film includes a polyvinyl alcohol resin (A) as a main component, wherein the ratio (X.sub.TD/X.sub.MD) of a degree of elongation (X.sub.TD) in the transverse direction (TD) of the water-soluble film to a degree of elongation (X.sub.MD) in the machine direction (MD) thereof when the water-soluble film is floated on the surface of water at 20° C. for 60 seconds is from 1.05 to 1.5. The water-soluble film exhibits reduced curling, exhibits reduced positional shift, and shows satisfactory sealability while forming a package.
Water-soluble film, chemical agent package, and method of producing water-soluble film
A water-soluble film includes a polyvinyl alcohol resin (A) as a main component, wherein the ratio (X.sub.TD/X.sub.MD) of a degree of elongation (X.sub.TD) in the transverse direction (TD) of the water-soluble film to a degree of elongation (X.sub.MD) in the machine direction (MD) thereof when the water-soluble film is floated on the surface of water at 20° C. for 60 seconds is from 1.05 to 1.5. The water-soluble film exhibits reduced curling, exhibits reduced positional shift, and shows satisfactory sealability while forming a package.
Layered structures
Systems and methods provide for forming layered structures. Textured tapes may be fabricated, having cast and/or embossed patterns that provide for desired flow characteristics in an assembly of stacked, rolled, and/or otherwise assembled tapes. In some cases, shear thinning materials may be formed into textured tapes using localized shear stress to induce shear thinning during a pattern formation. A pattern may be maintained after removal of the shear force due to the high viscosity of the material at low shear stress.
Layered structures
Systems and methods provide for forming layered structures. Textured tapes may be fabricated, having cast and/or embossed patterns that provide for desired flow characteristics in an assembly of stacked, rolled, and/or otherwise assembled tapes. In some cases, shear thinning materials may be formed into textured tapes using localized shear stress to induce shear thinning during a pattern formation. A pattern may be maintained after removal of the shear force due to the high viscosity of the material at low shear stress.
Thermal interface materials with thin film or metallization
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.