Formable inserts and related methods are disclosed herein. An example of forming a cover with a formable insert includes forming a first frame portion of the cover, attaching a formable insert to the first frame portion of the cover, and forming a second frame portion of the cover subsequent to the formation of the first frame portion to capture a perimeter edge of the formable insert in the second frame portion of the cover.

A manufacturing method of an insert case for a semiconductor device includes: placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case; and separating the slide core from the terminal and taking out the insert case from the mold.