To prevent a core from being damaged. A method for manufacturing a reactor includes a step of assembling a core that is configured of a core center part and a pair of core leg parts extending outwardly from the core center part to a coil in such a way that the core center part is inserted into a hollow part of the coil and the coil is sandwiched between the core center part and the pair of the core leg parts; and a step of performing resin molding by disposing the coil and the core that are assembled inside a mold and pouring resin into the mold from a gate provided on the mold to the side which is closer to the coil than the core legs parts are while having an outer surface of each of the core leg parts supported by a support part provided on the mold.

A lead block includes a lead block body and a plurality of busbars. The plurality of busbars is each partially embedded in the lead block body. The plurality of busbars includes a plurality of exposed portions. The plurality of exposed portions each extends in a longitudinal direction and disposed spaced apart from one another in an arrangement direction orthogonal to the longitudinal direction. The plurality of exposed portions includes at least one first exposed portion. The at least one first exposed portion includes a first surface and a first additional surface disposed on a reverse side of the first surface in the arrangement direction. The first surface includes a first cut surface having an area smaller than an area of the first surface. The first additional surface includes a first additional cut surface having an area smaller than an area of the first additional surface.

A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.

A device includes an electromagnetic radiation delivery system such as a laser of light emitting diode infrared emitter configured for delivery of electromagnetic radiation within a sealed canal such as an ear canal, a fiber optic cable configured for delivering or capturing the electromagnetic radiation within the sealed canal, and a photo detector coupled to the fiber optic cable forming a portion of a voice communication system. Other embodiments are disclosed.

A connector comprises an inner structure and an outer molded body. The inner structure comprises an inner molded body, a fit portion and a projecting portion. The fit portion projects forward from the inner molded body and is mated with a mating fit portion of a mating connector when the connector is connected to the mating connector. The projecting portion projects from the fit portion or the inner molded body. At least a part of the projecting portion is located outward of the fit portion in the upper-lower direction. The outer molded body has a rear portion and a front portion. The rear portion covers the inner molded body in a perpendicular plane perpendicular to the front-rear direction. The front portion extends forward from the rear portion and partially covers the fit portion in the perpendicular plane. The projecting portion is, at least in part, embedded in the front portion.

In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.

An encapsulation assembly includes a body located at edges of the functional glass; and a conductive module embedded in the body or located on a surface of the body, and electrically connected to a functional module on the functional glass. The process of forming an encapsulated glass from the encapsulation assembly for a functional glass can omit complicated manufacturing steps and save materials and thus reduce costs. An easy and stable control of the functional module in the glass can also be accomplished. Moreover, it is much easier to form an encapsulated glass from the glass, which facilitates glass mounting.

A method for manufacturing a heatable plastic component for a motor vehicle, which includes: providing a planar heating film, which has a first surface and a second surface that faces away from and is opposite the first surface, including at least one heating wire and connecting elements; introducing the planar heating film into an injection mold; mounting a connector housing onto the connecting elements; and back-molding the first surface with a plastic for manufacturing a first partial element of the heatable plastic component in the injection mold. In order to provide an improved method for manufacturing a heatable plastic component, it is proposed that a back-molding of the second surface with a plastic for manufacturing a second partial element of the heatable plastic component in the injection mold takes place such that a composite is formed from the first partial element, the planar heating film and the second partial element.

A method for producing a component provided with at least one structural element, in particular a component for an electrical machine, wherein the structural element(s) is fixed in a recess of a carrier body by a fixing material introduced in an injection moulding process, wherein the following method steps are provided: providing a carrier body provided with at least one recess, arranging the structural element(s) at least partially, in particular completely, within a first recess portion arranged in the recess of the carrier body, arranging at least one filler means in a second recess portion of the recess of the carrier body, injecting a fixing material, in particular consisting of plastic, into the first recess portion of the recess of the carrier body in the course of an injection moulding process, wherein the fixing material fixes the at least one structural element(s) within the recess.

A manufacturing method of a reactor includes: a coil mold step of forming a coil mold in which a first resin is molded to cover at least part of a coil; and a main body mold step of forming a main body mold in which a second resin is molded to cover at least part of an assembly body in which the coil, the coil mold, two I-cores, and an O-core surrounding the coil and the coil mold are assembled. In the coil mold step, a gap plate configured to fill a gap between positions where the two I-cores are placed is formed by molding with the first resin. In the main body mold step, gap plates each configured to fill a gap between the O-core and a corresponding one of the I-cores are formed by molding with the second resin.