An injection apparatus of the invention injects a molding material supplied from a material supply port, and includes a die, a material supply apparatus that extrudes the molding material that is thread-like or strip-like via the die, and a material guide apparatus that guides the molding material supplied via the die to the material supply port. The material discharge port of the material supply apparatus and the die protrude downward in the material supply apparatus, and a pressure inside the material guide apparatus is reduced by a pressure reducing apparatus from a pressure reducing port provided above the material discharge port of the material supply apparatus and the die.

An injection molding machine includes: a plunger provided inside a barrel and capable of moving forward and backward in an axial direction thereof and rotating about an axis thereof; a feed hole for feeding a molding material in liquid form into a front of the plunger; a packing provided on a backward side of the feed hole to prevent the molding material fed through the feed hole from flowing backward along the plunger; and a controller for controlling a retracting movement of the plunger based on pressure of the molding material fed from the feed hole to thereby perform metering. In this configuration, at least part of the feed hole is covered by a side surface of the plunger at least from start to end of the retracting movement.

An injection molding machine includes: a plunger provided inside a barrel and capable of moving forward and backward in an axial direction thereof and rotating about an axis thereof; a feed hole for feeding a molding material in liquid form into a front of the plunger; a packing provided on a backward side of the feed hole to prevent the molding material fed through the feed hole from flowing backward along the plunger; and a controller for controlling a retracting movement of the plunger based on pressure of the molding material fed from the feed hole to thereby perform metering. In this configuration, at least part of the feed hole is covered by a side surface of the plunger at least from start to end of the retracting movement.

A plastic molding system comprises: dispensing, pre-shaping and shaping cells and a transport subsystem. The dispensing cell has a station for dispensing a dose of plastic feedstock. The pre-shaping and shaping cells each comprise a plurality of stations for shaping the workpiece into a preform shape and into a final shape, respectively. The transport subsystem advances a workpiece along a selected one of a plurality of process paths to form a molded article. Each of the plurality of process paths is defined by a combination of stations of the dispensing cell, the pre-shaping cell and the shaping cell.

A thermosetting composition comprising the following component (A) and component (B), and having a viscosity of 0.1 Pa.Math.s or higher and 100 Pa.Math.s or lower at a shear rate of 10 s.sup.−1 at 25° C. measured in accordance with JIS K7117-2. (A) polybutadiene having a structural unit represented by the following formula (1A) and a structural unit represented by the following formula (1B), wherein the terminal group comprises a methacryloyl group or an acryloyl group (B) a thermal polymerization initiator

##STR00001##

A thermosetting composition comprising the following component (A) and component (B), and having a viscosity of 0.1 Pa.Math.s or higher and 100 Pa.Math.s or lower at a shear rate of 10 s.sup.−1 at 25° C. measured in accordance with JIS K7117-2. (A) polybutadiene having a structural unit represented by the following formula (1A) and a structural unit represented by the following formula (1B), wherein the terminal group comprises a methacryloyl group or an acryloyl group (B) a thermal polymerization initiator

##STR00001##

An injection molding machine capable of changing the position of the supply hole of the resin material in a cylinder as appropriate is provided. An injection molding machine according to one aspect of the present disclosure includes: a supply hole through which a resin material is supplied to an inside of a cylinder, the supply hole being formed in a side wall part of the cylinder; and a closing part that, when a torpedo piston moves to a side of an other end part of the cylinder in order to plasticize the resin material, moves together with the torpedo piston and closes the supply hole.

An injection molding machine capable of changing the position of the supply hole of the resin material in a cylinder as appropriate is provided. An injection molding machine according to one aspect of the present disclosure includes: a supply hole through which a resin material is supplied to an inside of a cylinder, the supply hole being formed in a side wall part of the cylinder; and a closing part that, when a torpedo piston moves to a side of an other end part of the cylinder in order to plasticize the resin material, moves together with the torpedo piston and closes the supply hole.

A semiconductor device of embodiments includes: a die pad; a semiconductor chip fixed on the die pad; and a sealing resin covering the semiconductor chip and at least a part of the die pad. The sealing resin has a first protruding portion provided on one side surface and a second protruding portion provided on another side surface. The cross-sectional area of the first protruding portion is equal to or more than 10% of the maximum cross-sectional area of the sealing resin. The cross-sectional area of the second protruding portion is equal to or more than 10%; of the maximum cross-sectional area. The maximum cross-sectional area is equal to or more than 6 mm.sup.2.

A method of recycling a mixed plastic waste comprising plastics having different melting temperatures includes conveying the mixed plastic waste through an extruder such that at least some of the higher melting point plastic is passes through the extruder without melting and is present in the extrudate as solid material.