B29C66/0012

Cycloolefin polymer bonding method

A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H.sub.2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.

Methods for forming bonded structures
10843413 · 2020-11-24 · ·

A method is provided in one example embodiment and may include assembling a first component and a second component together using, at least in part, a first adhesive film on the first component and a second adhesive film on the second component, wherein the first component and the second component are fully cured and the first adhesive film and the second adhesive film are at least partially uncured; and curing the first adhesive film and the second adhesive film to form a bonded structure.

MOLDING APPARATUS AND MOLDING METHOD FOR LOOP STRUCTURE

A molding apparatus for a loop structure includes a molding die within which both ends of an elongated structure are located in such a manner that the ends are in contact with each other, the elongated structure being formed of a rubber to which a peroxide cross-linking agent is added; a liftable housing including a lower part having an opening, the housing defining a containment space within which the molding die and the elongated structure are located when the housing is lowered; a degassing device configured to depressurize and degas the containment space; a heating device configured to heat the molding die in the containment space; a pressure device configured to pressurize the ends of the elongated structure with the use of the heated molding die in the containment space to proceed cross-linking reaction of the rubber, thereby bonding the ends of the elongated structure; and an elevating device configured to lift and lower the housing.

CYCLOOLEFIN POLYMER BONDING METHOD
20190381744 · 2019-12-19 · ·

A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H.sub.2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.

METHODS FOR FORMING BONDED STRUCTURES
20190291355 · 2019-09-26 ·

A method is provided in one example embodiment and may include assembling a first component and a second component together using, at least in part, a first adhesive film on the first component and a second adhesive film on the second component, wherein the first component and the second component are fully cured and the first adhesive film and the second adhesive film are at least partially uncured; and curing the first adhesive film and the second adhesive film to form a bonded structure.

Installation assembly and associated method for forming a bonded joint

An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.

WATER-SOLUBLE FILM AND CHEMICAL AGENT PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE SAME

A gelatin-containing water-soluble film having excellent water solubility, excellent mechanical properties such as film strength and elongation, and excellent sealability is provided as follows. The water-soluble film contains gelatin and a polyvinyl alcohol resin (A). The polyvinyl alcohol resin (A) contains a modified polyvinyl alcohol resin.