Patent classifications
B29C66/0014
METHOD OF JOINING ADDITIVELY MANUFACTURED COMPONENTS
A method for producing a component from two or more sub-components includes the steps of: producing each of the sub-components using an additive manufacturing process in which a resin, which is radiant-energy-curable, is partially cured using a selective application of radiant energy, wherein each sub-component includes a joint surface in which the resin is partially cured which is cured to a lesser degree than the remainder of the respective sub-component, so as to leave the joint surfaces in a condition suitable for bonding; assembling the sub-components with their respective joint surfaces in mutual contact; and performing a secondary cure of the partially-cured resin at the joint surfaces using an application of radiant energy, so as to further cure the partially-cured resin and bond the sub-components to each other, thereby forming the component.
Flexible package-forming machine for horizontal packaging by means of folding and welding a flexible band and method
A machine comprising: a flexible band (1) unwinding unit (11), a flexible band (1) folding unit (14), a drive unit (31) for moving the flexible band (1) in a forward movement direction (DA), a welding unit (16) and a laser beam cutting unit (53) for separating each individual flexible package from the flexible band (1) and for providing a fill opening in each flexible package by at least one fill opening cut, the laser beam cutting unit (53) having associated therewith a separator device, movable in a vertical direction and including an insertable separator element (41), interposed between the opposite faces of the folded flexible band (1), in an area adjacent to the fill opening (3), for separating the opposite faces of the flexible band (1) during cutting operations to prevent the fusion thereof.
METHOD AND APPARATUS FOR JOINING AT LEAST TWO PLASTIC PARTS
Method and apparatus for joining at least two plastic parts.
A method for joining at least two plastic parts (1, 5) along a predeterminable common joining point using infrared radiation (IR), is characterized in that each of the plastic parts (1, 5) to be joined is heated using infrared radiation at least along the joint by means of an assignable radiation source without touching the respective other plastic part (1, 5), that the respective one radiation source is operated independently and spatially separated from at least one further radiation source, that the radiation sources emit their respective infrared radiation to the respective assignable plastic part (1, 5) without contact and following the contour of the joint, and that the degree of heating by means of the respective infrared radiation is selected such that the joint is formed when the plastic parts (1, 5) are brought together.
PROCESS FOR THERMO-ADHESIVE BONDING OF SEMI-FINISHED PRODUCTS
A process for thermo-adhesive bonding of semi-finished products includes preparing an inner sock, an outer sock and an impermeable membrane provided with a thermo-adhesive disposed on an inner surface and/or an outer surface of the membrane; fitting the inner sock onto a rigid reference shape; fitting the membrane over the inner sock; fitting the outer sock over the membrane; heating the outer sock, the membrane and the inner sock arranged on the rigid reference shape in an oven until at least partial melting of the thermo-adhesive; cooling the outer sock, the membrane and the inner sock arranged on the rigid reference shape until cross-linking of the thermo-adhesive and stable bonding of the membrane to the outer sock and/or the inner sock. Also, exerting a substantially uniform pressure on the outer sock, the membrane and the inner sock disposed on the rigid reference shape during cooling, so as to compact them.
Dual purpose seal head assembly, tray sealing system, and method therefor
A seal head assembly includes a plurality of heat seal plates defining a corresponding plurality of heating areas, each heat seal plate including a heating element to independently control the temperature of the corresponding heating area.
Systems and methods to precisely control output pressure in buffered sprayers (DuO1)
Dispensing devices can include buffers. This obviates the need for continually pumping the device to dispense spray or foam. A buffer can be spring loaded, spring loaded combination, elastomeric or gas, and can be in line or adjacent to a piston chamber. Such sprayers and foamers can be mounted upside down. With a buffer, a piston chamber can deliver a greater amount of liquid per unit time than can be dispensed through the nozzle(s). The fraction of liquid that cannot be dispensed can be sent to the buffer for dispensing after the piston downstroke has completed. Volume of the piston chamber and buffer, pressure response of the buffer, throughput of the nozzle, and the minimum opening pressure of the outlet valve can be arranged to restrict the outlet pressures of liquid droplets exiting the nozzle within a defined range.
Portion Unit Of A Cleaning Agent
A portion unit of a cleaning agent, having a cleaning agent composition and a chamber which receives the cleaning agent composition and includes a chamber wall that delimits the chamber and has a layer thickness D. The chamber includes a main volume and at least one auxiliary volume, and the cleaning agent composition can freely enter the at least one auxiliary volume from the main volume and vice versa, wherein the chamber wall is formed in a transition region between the main volume and the at least one auxiliary volume in a substantially stepped manner. The invention additionally relates to a method for producing such a portion unit.
Fluid viscosity control during wafer bonding
Techniques and mechanisms for bonding a first wafer to a second wafer in the presence of a fluid, the viscosity of which is greater than a viscosity of air at standard ambient temperature and pressure. In an embodiment, a first surface of the first wafer is brought into close proximity to a second surface of the second wafer. The fluid is provided between the first surface and the second surface when a first region of the first surface is made to contact a second region of the second surface to form a bond. The viscosity of the fluid mitigates a rate of propagation of the bond along a wafer surface, which in turn mitigates wafer deformation and/or stress between wafers. In another embodiment, the viscosity of the fluid is changed dynamically while the bond propagates between the first surface and the second surface.
METHOD FOR PRODUCING A PORTION UNIT OF A DETERGENT
A method for producing a portion unit of a detergent by inserting a base element made from a first film portion into a deep-drawing mold that forms a holding volume from the first film portion, the holding volume having a plurality of chambers spaced apart from one another; pouring at least one detergent composition into the chambers; placing a cover element made from a second film portion onto the filled chambers; connecting the cover element to the base element, which forms a film wrapping, sealing seams being formed between adjacent wall portions of the chambers; removing the portion unit from the deep-drawing mold, wherein the outside of the film wrapping is then wetted at least in the region of the adjacent wall portions and, by pressure being exerted, the sealing seams are compressed and the adjacent wall portions are brought into contact with one another and interconnected.
METHOD FOR SEALING MEDICAL DEVICES
The present disclosure relates to a method of sealing ports of medical devices, e.g., filtration and/or diffusion devices like ultrafilters and capillary dialyzers.