There is provided a method for producing a metal-resin composite which includes a resin member and a metal member having a roughened surface in at least a portion of the surface thereof, the resin member being joined so as to be in contact with at least a portion of the roughened surface. The method includes a step of joining the resin member and the metal member by melting the resin member with the frictional heat generated in the surface of the metal member on its side opposite to the resin member in a state where the metal member and the resin member are superposed. The method includes making adjustment so that when the roughened surface is measured at arbitrary five points by using a confocal microscope according to ISO 25178, the developed area ratio (Sdr) is 5 or more in terms of number-average value.

A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.

The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 μm.

A fixing structure of a wiring member includes an adhesive member, a wire-like transmission member, and an adherent. The adhesive member includes a planar base body having conductivity, a first hot-melt adhesive agent provided on one main surface of the base body, and a second hot-melt adhesive agent provided on another main surface of the base body. The base body can generate heat by induction heating using an induction heating apparatus. The wire-like transmission member is bonded to the first hot-melt adhesive agent in the adhesive member on a side of the one main surface of the base body. The adherent is bonded to the second hot-melt adhesive agent in the adhesive member on a side of the another main surface of the base body.

Disclosed is a copper alloy article including: a substrate 10 made of a copper alloy; a polyester-based resin body 40; and a compound layer 20 for bonding the substrate 10 and the polyester-based resin body 40, wherein the compound layer 20 contains; a compound having a nitrogen-containing functional group and a silanol group, and an alkane type amine-based silane coupling agent.

A production method for a joined object is a method for producing a joined object by joining two objects together. The method includes: irradiating joining surfaces of the respective two objects with plasma; and bonding the joining surfaces irradiated with plasma, at a temperature lower than a melting point of a substance included in the objects.

A method for manufacturing a metal-clad laminate sheet including forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and providing the laminate sheet with a heat treatment which satisfies conditions (1) and (2) below: (1) a heat treatment temperature ranges between 1° C. inclusive and 50° C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film. (2) a time for the heat treatment ranges from one second to 10 minutes.

Disclosed is a copper alloy article including: a substrate 10 made of a copper alloy; a polyester-based resin body 40; and a compound layer 20 for bonding the substrate 10 and the polyester-based resin body 40, wherein the compound layer 20 contains; a compound having a nitrogen-containing functional group and a silanol group, and an alkane type amine-based silane coupling agent.

A method of directly joining a polymer to a metal along a joint interface through the formation of CO-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; physically contacting at least one of the metal and the polymer; and applying compression pressure to the joint interface of the metal and the polymer when the metal is above the glass transition temperature of the polymer and less than the flash ignition temperature of the polymer and less than the metal melting temperature of the metal to generate intimate atomic contact between the metal and the polymer to create CO-M chemical bonds between the metal and the polymer.

A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380 C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380 C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.