B29C66/70

Laser welding of transparent and opaque materials
09787345 · 2017-10-10 · ·

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Method of 3D printing plastic molding compound on foil ply

A method for producing a molded body having the following steps: a) providing a foil ply; b) applying a plastic molding compound in a predefined three-dimensional shape onto the foil ply by means of a three-dimensional printing method.

Methods, processes, and apparatuses for producing welded substrates

A welding process may be configured to convert a substrate into a welded substrate by applying a process solvent to the substrate, wherein the process solvent interrupts one or more intermolecular force between one or more component in the substrate. The substrate may be configured as a natural fiber, such as cellulose, hemicelluloses, and silk. The process solvent may be configured as an ionic-liquid based solvent and the welded substrate may be a congealed network after the process solvent has been adequately swollen and/or mobilized the substrate. A welding process may be configured such that individual fibers of a substrate are not fully dissolved such that material in the fiber core may be left in the native state by controlling process variables. The welding process fibers may have a tenacity 10% or 20% greater or a diameter 25% less than that of a cellulosic-based yarn substrate.

MULTI-FUNCTIONAL INTERFACE/SURFACE LAYER FOR THERMOPLASTIC COMPONENTS

A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.

Method, apparatus and applicator for applying a coating on a surface of a lamination
10982705 · 2021-04-20 · ·

A method for applying a coating on a surface of a lamination of plies of fiber-reinforced plastic material. The surface of the lamination includes exposed ends of reinforcement fibers. The method includes selecting an electrically conductive material that is abradable in a solid state by rubbing against the surface of the lamination having exposed ends of reinforcement fibers, and rubbing the electrically conductive material against the surface of the lamination to cause particles of electrically conductive material to be abraded and deposited on the surface of the lamination.

Methods and assemblies for forming features in composite components
10737444 · 2020-08-11 · ·

Various methods and assemblies are provided for producing composite components having formed in features. For example, a method may comprise depositing a composite material on a base tool; aligning an aperture forming tool with a tooling aperture in the base tool; inserting the aperture forming tool through the composite material to form an aperture in the composite material; deploying a feature forming tool to press the composite material into one or more recesses; and processing the composite material with the feature forming tool in contact with the composite material. In some embodiments, the feature forming tool includes a stem extending through the composite material and into the base tool, as well as a feature forming head that is brought into contact with and processed with the composite material. In other embodiments, a tooling assembly holds a pin in place during processing to fix the pin in the composite component.

Bonding method of crystal body

To improve the production yield rate of a synthesis corundum cell superior in translucency, chemical resistance or an optical component comprising calcium fluoride. On the other end side of synthetic corundum piece, spacer intervenes between the surfaces which will be bonded. The spacer is crushed flat by pressure force which effects the other end side of synthetic corundum piece in the case of heat-treatment after the temporary bonding. Thereby, the spacer does not disturb the synthetic optical contacting or chemical pressurized fusion bonding state of corundum piece.

Methods, processes, and apparatuses for producing welded substrates

A welding process may be configured to convert a substrate into a welded substrate by applying a process solvent to the substrate, wherein the process solvent interrupts one or more intermolecular force between one or more component in the substrate. The substrate may be configured as a natural fiber, such as cellulose, hemicelluloses, and silk. The process solvent may be configured as an ionic-liquid based solvent and the welded substrate may be a congealed network after the process solvent has been adequately swollen and/or mobilized the substrate. A welding process may be configured such that individual fibers of a substrate are not fully dissolved such that material in the fiber core may be left in the native state by controlling process variables. The welding process fibers may have a tenacity 10% or 20% greater or a diameter 25% less than that of a cellulosic-based yarn substrate.

Method, Apparatus and Applicator for Applying a Coating on a Surface of a Lamination
20190285109 · 2019-09-19 · ·

A method for applying a coating on a surface of a lamination of plies of fiber-reinforced plastic material. The surface of the lamination includes exposed ends of reinforcement fibers. The method includes selecting an electrically conductive material that is abradable in a solid state by rubbing against the surface of the lamination having exposed ends of reinforcement fibers, and rubbing the electrically conductive material against the surface of the lamination to cause particles of electrically conductive material to be abraded and deposited on the surface of the lamination.

Multi-functional interface/surface layer for thermoplastic components

A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.