A joining punch for a joining device for producing a joining connection, in particular an adhesive connection, between a first joining part, for example a cover glass, and a second joining part, for example a housing, has at least one force-receiving part to which a contact force can be applied and having at least two pressing parts for applying pressure to the first joining part. The at least two pressing parts are arranged and/or formed independently of one another on the joining punch in such a manner that they are tiltable relative to the force-receiving part. The joining punch is embodied in a joining device. The two joining parts can be pressed together according to a nominal distribution of the forces or pressures, in particular uniformly using the joining device. Unevennesses and deformations of the joining parts, in particular of the first joining part, can be compensated.

An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.