Patent classifications
B29C66/8185
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
INTELLIGENT TRASH CAN WITH CLOSING AND PACKING MECHANISM
An intelligent trash can includes a closing and packing mechanism for automatic closing of a garbage bag. The closing and packing mechanism include a pair of first pressing rods and a second pressing rod. The pair of first pressing rods are configured for being synchronously approached or synchronously moved away under the driving of a first belt transmission unit. The second pressing rod is perpendicular to the pair of first pressing rods. The second pressing rod is configured to perform linear reciprocating motion along a length direction of the pair of first pressing rods under the driving of the second belt transmission unit.
HEATER FOR SEALING PROCESS OF SECONDARY BATTERY
A disclosed heater for a sealing process of a secondary battery includes: a sealing bar heating and pressing a pouch foil to be sealed; a plurality of sub-heating unit longitudinally disposed inside the sealing bar to respectively independently supply heat to a plurality of sections separated in the longitudinal direction of the sealing bar; temperature sensing units disposed inside the sealing bar and sensing temperature at positions on the surfaces being in contact with the pouch foil; and a control unit controlling heating temperature of the plurality of sub-heating units on the basis of the temperature sensed by the temperature sensing units.
Welding apparatus
There is provided an apparatus 1 that includes a pair of molds 10a and 10b that press together, heat, and weld an overlapping part of a plurality of film-like members, a pair of heater blocks 20a and 20b that respectively support the pair of molds; a plurality of first support blocks 37 that are connected via a plurality of rod-like members 50, which midway include parts that restrict transmission of heat, to one heater block 20a; a plurality of second support blocks 38 that are connected via the plurality of rod-like members to the other heater block 20b; and a driving mechanism 60 that changes, via the support blocks, a gap between the pair of molds to press together the film-like members. The plurality of first support blocks include at least one movable support block 39 including a mechanism 35 that moves in a first direction relative to the driving mechanism corresponding to thermal deformation in the first direction of the heater block to be supported, and the plurality of second support blocks include at least one movable support block 39.
Method of manufacturing a semiconductor package
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
Edge dams for fabrication of composite parts
Systems and methods are provided for composite part fabrication. One embodiment is a method that includes placing a laminate onto a base of a mandrel between side walls of the mandrel, placing edge dams between the side walls and the laminate that each abut the laminate and abut one of the side walls, each edge dam having a Coefficient of Thermal Expansion (CTE) greater than a CTE of the mandrel, the CTE of the mandrel being greater than a CTE of the laminate, heating the laminate, edge dams, and mandrel, and during the heating, thermally expanding the edge dams an amount that corresponds with a difference in thermal expansion between the laminate and the mandrel.
WELDING APPARATUS
There is provided an apparatus 1 that includes a pair of molds 10a and 10b that press together, heat, and weld an overlapping part of a plurality of film-like members, a pair of heater blocks 20a and 20b that respectively support the pair of molds; a plurality of first support blocks 37 that are connected via a plurality of rod-like members 50, which midway include parts that restrict transmission of heat, to one heater block 20a; a plurality of second support blocks 38 that are connected via the plurality of rod-like members to the other heater block 20b; and a driving mechanism 60 that changes, via the support blocks, a gap between the pair of molds to press together the film-like members. The plurality of first support blocks include at least one movable support block 39 including a mechanism 35 that moves in a first direction relative to the driving mechanism corresponding to thermal deformation in the first direction of the heater block to be supported, and the plurality of second support blocks include at least one movable support block 39.
EDGE DAMS FOR FABRICATION OF COMPOSITE PARTS
Systems and methods are provided for composite part fabrication. One embodiment is a method that includes placing a laminate onto a base of a mandrel between side walls of the mandrel, placing edge dams between the side walls and the laminate that each abut the laminate and abut one of the side walls, each edge dam having a Coefficient of Thermal Expansion (CTE) greater than a CTE of the mandrel, the CTE of the mandrel being greater than a CTE of the laminate, heating the laminate, edge dams, and mandrel, and during the heating, thermally expanding the edge dams an amount that corresponds with a difference in thermal expansion between the laminate and the mandrel.