Patent classifications
B29C66/91216
Pulsed light system
An apparatus for manufacturing a composite article from a composite material. The apparatus comprising: a pulsed broadband radiation source comprising a flashlamp and a light guide adapted to guide light emitted by the pulsed broadband radiation source to a target area. The light guide comprises at least a portion ahead of the pulsed broadband radiation source, relative to the target area, comprising a light transmitting material.
METHOD AND SYSTEM FOR WELDING THERMOPLASTIC PANELS
A system and method for welding thermoplastic components is provided. The system includes a component positioning system and a welding subsystem. The component positioning system includes a trailing force applicator having first and second lateral side trailing force applicators disposed on opposite lateral sides of a weld line. The welding subsystem is configured to weld the thermoplastic components together at a weld zone. The first and second lateral side trailing force applicators are laterally spaced apart from the weld zone, and at least a portion of the first and second lateral side trailing force applicators are disposed aft of the weld zone. During welding the first and second lateral side trailing force applicators and a welding subsystem probe are moved relative to the thermoplastic components, or vice versa.
Packaging apparatus for film inflation and method thereof
A packaging apparatus with an improved pinch roller apparatus, fluid supply apparatus, and/or a sealing apparatus. The pinch roller apparatus (e.g., comprising one or more guide and/or pinch rollers) is used to deliver film material to the fluid supply apparatus (e.g., nozzle and blower apparatus, or the like) that fills one or more chambers of the film material with fluid (e.g., air, gas, or other like fluid), and the film material is then sealed by a sealing apparatus (e.g., using one or more heating elements with an improved temperature sensor configuration) that seals the fluid within the one or more chambers in order to form the inflated article (e.g., inflated packaging material). In particular, the sealing apparatus provides improved sealing through the improved accuracy of the temperature reading in the heating zone, in part, by locating a sensor between a heating element and a protective member that covers the sensor.
METHOD FOR EVALUATING AN ASSEMBLY BY WELDING OF PARTS BASED ON THERMOPLASTIC MATERIALS
The present invention relates to a method for evaluating an assembly by welding of parts made of thermoplastic materials, to a test piece and its associated uses, to an installation for implementing this method and to the associated welding system.
Induction welding using a heat sink and/or cooling
A method of dissipating heat from a surface of a first thermoplastic composite (TPC) being inductively welded with a second thermoplastic composite (TPC) includes flexing a heat sink during placement to conform to the surface of the first TPC, cooling the heat sink, applying inductive heat to a weld interface area between the first TPC and the second TPC, and drawing off heat via the heat sink from the surface of the first TPC.
Heat sealing apparatus
A heat seal between a plastic bag and a plastic sheet is used to provide a more secure and reliable seal to define a modified atmosphere for a pallet of perishables. The heat seal reduces atmosphere failures and aids in providing a more consistent atmosphere in the pallet bag system thus reducing the number of pallets that have an out of specification atmosphere. The heat seal may be created with a heating sealing apparatuses that is part of a system used to load and seal a load of containers of perishables onto a pallet. The heat sealing apparatus uses two heated rollers coupled to a rotating arm to contact and heat seal a plastic bag to a plastic seal that enclose a palletized load of perishables that are rotated on a turntable.
Microchip affixing probe and method of use
Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.
METHOD FOR CHECKING, AND DEVICE FOR MEASURING, COMPONENTS OF A PIPE PRIOR TO WELDING
The invention relates to a method for checking, prior to welding, two components made of polymer material, the method comprising a step of determining respective values relating to the roughness of the components, a step of determining respective values relating to the cleanliness of the components, a step of determining respective values relating to the temperature of the components and automated means for halting progression to a subsequent method step should the predetermined conditions not be met.
DEVICE FOR MEASURING COMPONENTS OF A PIPE PRIOR TO WELDING
The invention relates to a device (1) for measuring the surface condition of a component (4, 5, 6). Said device (1) comprises a measurement member (2) comprising at least one sensor (21, 22, 23) capable of measuring at least one datum relating to the surface condition of the component (4, 5, 6) and at least one transmitter (24) capable of transmitting the datum from the sensor (21, 22, 23). The measurement device (1) also comprises a support (3) for the measurement member (2), the support comprising means for connecting same to the component (4, 5, 6).
METHOD FOR THE INSPECTION OF BONDING PATTERNS OF PACKAGES FOR PRODUCTS
A non-destructive, non-invasive method for inspection of bonding patterns of packages for products, such as patches or medicated patches, involves thermally probing the packages and the bonding patterns and retrieving a thermal response thereof. The inspection is based in the analysis of the thermal response.