An exemplary air cushion inflation machine includes: a first terminal connected to a direct current input; a second terminal; a reference resistor powered by the direct current input; an op-amp; and a transistor. The first terminal of the op-amp is connected to a variable voltage source and the second terminal of the op-amp is connected to the reference resistor. The transistor has a base connected to an output of the op-amp, an emitter connected to the reference resistor, and a collector connected to a first terminal of a sealing band apparatus having first and second terminals. A meltable material placed between the first and second terminals is melted by resistance of current flowing between the first and second terminals. The variable voltage source changes voltage based on a voltage drop measured across the first and second terminals by a voltage measurement device and the constant current.

A process is provided for heat sealing substrate layers. The process comprising: conveying an upper die having a heating conductor and a lower die having a heating conductor to a sealing region, where a substrate is applied to one or more items; activating a power supply system; monitoring, via the power supply system, a temperature of the heating conductor of the upper die when in the sealing region; monitoring, via the power supply system, a temperature of the heating conductor of the lower die when in the sealing region, wherein the monitoring of the temperature of the heating conductor of the upper die is performed independently of the monitoring of the temperature of the heating conductor of the lower die; supplying power to the upper die based on the temperature of the heating conductor of the upper die; supplying power to the lower die based on the temperature of the heating conductor of the lower die, wherein the power is supplied to the lower die independently of the power being supplied to the upper die.

A process is provided for heat sealing substrate layers. The process comprising: conveying an upper die having a heating conductor and a lower die having a heating conductor to a sealing region, where a substrate is applied to one or more items; activating a power supply system; monitoring, via the power supply system, a temperature of the heating conductor of the upper die when in the sealing region; monitoring, via the power supply system, a temperature of the heating conductor of the lower die when in the sealing region, wherein the monitoring of the temperature of the heating conductor of the upper die is performed independently of the monitoring of the temperature of the heating conductor of the lower die; supplying power to the upper die based on the temperature of the heating conductor of the upper die; supplying power to the lower die based on the temperature of the heating conductor of the lower die, wherein the power is supplied to the lower die independently of the power being supplied to the upper die.

An automated heat shrink device, useful for forming a connection between two tubular sections having a polymeric outer surface jacket, for example, a connection between two sections of a district heating pipeline, and a method of use thereof. The device is configured such that it requires minimal clearance to either side of the pipeline when being used.

A process for packaging a product arranged on a support comprising unrolling a film, moving the film to a packaging assembly defining at its inside a packaging chamber, progressively moving a number of supports inside the packaging chamber of the packaging assembly, closing the packaging chamber with the film sheets held above the respective support, optionally causing one or both of: a gas withdrawal from the hermetically closed packaging chamber and gas injection of a gas mixture of controlled composition, heat sealing the film to said support, wherein the heat sealing uses one or more heaters having heating surfaces which are heated for discrete and short time periods only. An apparatus for performing the above process is also disclosed.

A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.

A method and an apparatus for welding a first object to a second object, wherein the first object is produced from a thermoset and comprises a thermoplastic material outer layer, wherein the second object comprises at least one thermoplastic material outer layer. In addition, a layer of carbon nanotubes is applied to the thermoplastic material outer layer of the first object, and the second object is placed onto the first object. At least some of the thermoplastic material outer layer of the second object lies atop the applied layer of carbon nanotubes. In addition, a potential is applied to the layer of carbon nanotubes, such that an electrical current flows through the carbon nanotubes, wherein the thermoplastic material outer layer of the first object and the thermoplastic material outer layer of the second object are heated and are welded to one another.

A process for packaging a product arranged on a support comprising unrolling a film, moving the film to a packaging assembly defining at its inside a packaging chamber, progressively moving a number of supports inside the packaging chamber of the packaging assembly, closing the packaging chamber with the film sheets held above the respective support, optionally causing one or both of: a gas withdrawal from the hermetically closed packaging chamber and gas injection of a gas mixture of controlled composition, heat sealing the film to said support, wherein the heat sealing uses one or more heaters having heating surfaces which are heated for discrete and short time periods only. An apparatus for performing the above process is also disclosed.

A heating element for resistance welding of thermoplastic components for aircraft comprises electrically conductive elements in the form of wires or fibers, which heat up upon application of an electric voltage to the heating element, to weld a first component to a second component in a region electrically heated by the heating element. The electrically conductive elements extend parallel to one another between contact regions for electrically contacting the heating element. After the welding procedure, the heating element remains between the welded components to enhance the strength of the welded bond. A device for bonding thermoplastic components by resistance welding comprises the heating element and a unit in the form of roller electrodes for displacing an electrically heated region of the components in the welding direction. The electrically conductive elements extend parallel to the axis of rotation of the roller electrodes.

A pill sorter with bag sealer designed for the dispensation and storage of easily transportable packages of medication. The pill sorter has one or more independent chambers that can store pills or other medication. The pill sorter dispenses medication through a funneled lid, allowing the user to dispense a single chamber's medication into a plastic bag. The plastic bag is placed into a bag sealer having an activation button, light-emitting diode (LED), battery, microprocessor, and sealing element. The activation time of the sealing element is adjusted by the microprocessor based upon the measured level of charge present in the battery, providing a one-touch sealing solution to the user. The sealing element seals the plastic bag, which has a perforated seal, allowing for easy opening of the plastic bag when the medication is needed.