A system for consolidating materials, comprising a sonotrode configured to direct ultrasonic energy into materials to be consolidated, wherein the materials to be consolidated have both a glass transition temperature and a melting temperature; a non-rigid consolidating material in proximity to the sonotrode, wherein the non-rigid consolidating material and sonotrode define a region therebetween for receiving the materials to be consolidated, and wherein the non-rigid consolidating material has a glass transition temperature that is higher than the glass transition temperature of the materials to be consolidated and a melting temperature that is higher than the melting temperature of the materials to be consolidated.

Provided are a rubber sheet member joining device and method. At least one opposing surface of a pair of gripping parts is provided with a contact member having a contact surface projecting toward an other opposing surface of the pair of gripping parts; the pair of gripping parts grip ranges in proximity to end surfaces in a state in which end surfaces project from the one opposing surface toward the other opposing surface; the total of end surface projection amounts of the end surfaces from the opposing surfaces is set to be a predetermined length larger than a separation distance between the opposing surfaces when the contact member is sandwiched between the opposing surfaces; and by bringing the contact member into a state of being sandwiched between the opposing surfaces, the movement of the gripping parts in proximity to each other is stopped and the end surfaces are joined together.

Provided are a rubber sheet member joining device and method. At least one opposing surface of a pair of gripping parts is provided with a contact member having a contact surface projecting toward an other opposing surface of the pair of gripping parts; the pair of gripping parts grip ranges in proximity to end surfaces in a state in which end surfaces project from the one opposing surface toward the other opposing surface; the total of end surface projection amounts of the end surfaces from the opposing surfaces is set to be a predetermined length larger than a separation distance between the opposing surfaces when the contact member is sandwiched between the opposing surfaces; and by bringing the contact member into a state of being sandwiched between the opposing surfaces, the movement of the gripping parts in proximity to each other is stopped and the end surfaces are joined together.

A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

A method for determining a sufficient stent removal force includes providing a balloon fastened to a shaft with a stent securely clamped to the balloon. In order to move or remove the balloon from the stent, a stent removal force has to act on the balloon in the axial direction. The stent, which surrounds the balloon, is clamped between first and second holding jaws with a predefined contact pressure perpendicularly to the axial direction. A predefined, desired stent removal force is then exerted on the balloon via the shaft in the axial direction, at which the balloon should not be removed from the stent. If the balloon moves axially relative to the stent, the force is considered to be too low and the shaft-balloon-stent assembly is discarded as a reject. If the stent position remains constant, the stent removal force is considered to be sufficient.

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.

A labelling unit and a method for labelling containers is provided. Said method provides rapid and reliable switching movements with low noise development and low wear of the mechanical components in that suction bars for suctioning label areas at places where container gaps occur can be actively switched back to an inner position, in which they do not come into contact with a gluing unit, and in that the switching process is triggered with the aid of a stationary toggle lever.

A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.

A transfer method for expanding pitches of devices includes: providing a first substrate with micro devices having the pitches being a predetermined value in a first direction and a second direction; transferring the micro devices to a first roller by contacting it with the micro devices, wherein a pitch of contact line portions on the first roller is N times of the predetermined value; transferring the micro devices on the first roller to a second substrate; rotating the second substrate by 90 degrees; transferring the micro devices to a second roller by rolling the second roller to contact the micro devices; and then transferring the micro devices to a third substrate to expand the pitch of the micro devices in both the first and the second directions. The portions in contact with the micro devices all have adhesive layers with different adhesion operation windows.

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures.