Patent classifications
B29C66/952
RESIN MEMBER MACHINING METHOD, RESIN MEMBER MACHINING APPARATUS, AND RESIN COMPONENT MANUFACTURING METHOD
A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.
Method and device for joining moulded parts by electromagnetic welding
A method for joining moulded parts by electromagnetic welding. A joining inductor is moved along contact surfaces of the moulded parts, generating an electromagnetic field in an induction-sensitive component of the moulded part(s) to heat a thermally activated coupling means of the moulded part(s) to above a melting temperature of the coupling means. The strength of the electromagnetic field suitable for joining is determined by previously moving a sensing inductor along the contact plane, generating a relatively weak electromagnetic field to slightly heat the thermally activated coupling means to a sensing temperature, measuring the field strength generated by the sensing inductor in the moulded part(s), determining a discrepancy between the measured field strength of the sensing inductor and the field strength suitable for joining, and adjusting the field strength suitable for joining to close the discrepancy. A device for carrying out the method.
METHOD AND DEVICE FOR JOINING MOULDED PARTS BY ELECTROMAGNETIC WELDING
A method for joining moulded parts by electromagnetic welding. A joining inductor is moved along contact surfaces of the moulded parts, generating an electromagnetic field in an induction-sensitive component of the moulded part(s) to heat a thermally activated coupling means of the moulded part(s) to above a melting temperature of the coupling means. The strength of the electromagnetic field suitable for joining is determined by previously moving a sensing inductor along the contact plane, generating a relatively weak electromagnetic field to slightly heat the thermally activated coupling means to a sensing temperature, measuring the field strength generated by the sensing inductor in the moulded part(s), determining a discrepancy between the measured field strength of the sensing inductor and the field strength suitable for joining, and adjusting the field strength suitable for joining to close the discrepancy. A device for carrying out the method.
Skin-to-core bond line mapping system and method
A skin-to-core bond line mapping system and method is disclosed. Layered composite components formed by “sandwiching” multiple materials together require a continuous bond between those materials with voids below particular thresholds that can vary by application. The skin-to-core bond line mapping system can include a laminate, an adhesive, a separator film, a core, a breather, a layup tool, bagging material, sealant, and a vacuum port. By employing systems and processes that layer separator film over adhesive and applying a core proximate the adhesive, a bagging material can be disposed over the materials to facilitate vacuum compaction, thereby impressing core impressions on the adhesive to map the areas between the skin and core that have good contact. An iterative process is disclosed, in which additional adhesive can be used to build the bond line until contact is made (or engineering tolerance is reached).
Fiber placement system and method with modulated laser scan heating
A fiber placement system including a compaction roller rotatable about an axis of rotation, the compaction roller at least partially defining a compaction nip region, and a laser heating assembly including a laser that emits a beam of electromagnetic radiation and a scan head defining a scan field, the scan field being aligned with the compaction nip region, wherein the scan head scans the beam within the scan field.
SKIN-TO-CORE BOND LINE MAPPING SYSTEM AND METHOD
A skin-to-core bond line mapping system and method is disclosed. Layered composite components formed by sandwiching multiple materials together require a continuous bond between those materials with voids below particular thresholds that can vary by application. The skin-to-core bond line mapping system can include a laminate, an adhesive, a separator film, a core, a breather, a layup tool, bagging material, sealant, and a vacuum port. By employing systems and processes that layer separator film over adhesive and applying a core proximate the adhesive, a bagging material can be disposed over the materials to facilitate vacuum compaction, thereby impressing core impressions on the adhesive to map the areas between the skin and core that have good contact. An iterative process is disclosed, in which additional adhesive can be used to build the bond line until contact is made (or engineering tolerance is reached).
Resin member machining method, resin member machining apparatus, and resin component manufacturing method
A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.
Fiber Placement System and Method with Modulated Laser Scan Heating
A fiber placement system including a compaction roller rotatable about an axis of rotation, the compaction roller at least partially defining a compaction nip region, and a laser heating assembly including a laser that emits a beam of electromagnetic radiation and a scan head defining a scan field, the scan field being aligned with the compaction nip region, wherein the scan head scans the beam within the scan field.
Fiber placement system and method with modulated laser scan heating
A fiber placement system including a compaction roller rotatable about an axis of rotation, the compaction roller at least partially defining a compaction nip region, and a laser heating assembly including a laser that emits a beam of electromagnetic radiation and a scan head defining a scan field, the scan field being aligned with the compaction nip region, wherein the scan head scans the beam within the scan field.
Method of producing a laminate comprising a cured adhesive sheet
Problem: To provide a method for producing a laminate comprising a thick, highly transparent cured adhesive sheet exhibiting flow characteristics accompanied by satisfactory fluidity and satisfactory initial adhesion to an adherend before irradiation, and satisfactory hardness (in particular, a high storage modulus) after irradiation. Solution: A method for producing a laminate comprising a first substrate, a second substrate, and a cured adhesive sheet disposed therebetween, the method comprising steps of: forming into a sheet a radiation-curable adhesive sheet precursor comprising a polymer/monomer mixture comprising a partially polymerized (meth) acrylic monomer, a monomer having radiation reactive sites activated by short-wavelength radiation of a first wavelength or less, and a photoinitiator for initiating polymerization of the polymer/monomer mixture and the radiation reactive site-possessing monomer via radiation of a wavelength greater than the first wavelength; irradiating the precursor with radiation of a wavelength greater than the specific wavelength to polymerize the radiation-curable adhesive sheet precursor, forming a radiation-curable adhesive sheet; disposing the radiation-curable adhesive sheet adjacent to at least one surface of the first substrate; disposing the second substrate adjacent to a radiation-curable adhesive sheet; applying heat and/or pressure to the radiation-curable adhesive sheet; and irradiating the radiation-curable adhesive sheet with radiation comprising short-wavelength radiation of a first wavelength or less to obtain a cured adhesive sheet.