B29C70/72

POLYMER JACKETED POWDER CORE PROJECTILE
20230039980 · 2023-02-09 · ·

A method is disclosed for coating a projectile for use in an ammunition cartridge. A polymer jacket is applied to an undersized projectile core of a first standard caliber to bring the outer dimensions of the jacketed projectile into compliance with those of a second, larger caliber projectile. The polymer jacket coating may produce a non-uniform outer diameter of the polymer jacketed projectile and may include a plurality of circular cavities defined therein. The polymer-jacketed projectile may be a bullet for pistol or rifle ammunition, or a pellet, or shot for use in a shotgun shell.

POLYMER JACKETED POWDER CORE PROJECTILE
20230039980 · 2023-02-09 · ·

A method is disclosed for coating a projectile for use in an ammunition cartridge. A polymer jacket is applied to an undersized projectile core of a first standard caliber to bring the outer dimensions of the jacketed projectile into compliance with those of a second, larger caliber projectile. The polymer jacket coating may produce a non-uniform outer diameter of the polymer jacketed projectile and may include a plurality of circular cavities defined therein. The polymer-jacketed projectile may be a bullet for pistol or rifle ammunition, or a pellet, or shot for use in a shotgun shell.

Continuous encapsulated linear lighting produced in segments
11592171 · 2023-02-28 · ·

A method for making continuous encapsulated linear lighting is disclosed. In this method, a PCB is placed within a channel, and the channel is dammed by one or more stoppers. The dammed segment is filled and then caused or allowed to cure. The stoppers are then removed from their initial positions and moved along the channel. If one runs out of channel before the desired length of linear lighting is achieved, a second piece of channel is abutted to the previous segment of channel, the PCB is laid into it, and a segment is dammed, filled, and cured. The process continues iteratively until the desired length is achieved or more channel is required. The PCB may initially be cut to the full desired length and applied to the channel piecewise as needed.

Continuous encapsulated linear lighting produced in segments
11592171 · 2023-02-28 · ·

A method for making continuous encapsulated linear lighting is disclosed. In this method, a PCB is placed within a channel, and the channel is dammed by one or more stoppers. The dammed segment is filled and then caused or allowed to cure. The stoppers are then removed from their initial positions and moved along the channel. If one runs out of channel before the desired length of linear lighting is achieved, a second piece of channel is abutted to the previous segment of channel, the PCB is laid into it, and a segment is dammed, filled, and cured. The process continues iteratively until the desired length is achieved or more channel is required. The PCB may initially be cut to the full desired length and applied to the channel piecewise as needed.

Microwire Array Devices and Methods for Fabricating Polymeric Sheets Containing Microwires
20180007819 · 2018-01-04 ·

A method for fabricating polymeric sheets containing microwires includes encapsulating at least a portion of individual lengths of a plurality of microwires in a non-conductive polymeric sheet while the microwires are attached to the substrate. The microwires are then detached from the substrate without removing the microwires from the polymeric sheet. The detaching step forms a separated polymeric sheet containing the detached microwires. Individual detached microwires of the plurality are approximately perpendicular to the separated polymeric sheet. A microwire array device includes a non-conductive polymeric sheet and a plurality of microwires. Individual microwires of the plurality have an independent length at least partially encapsulated by the polymeric sheet, are approximately perpendicular to the polymeric sheet, and contain magnetic ferrite.

CARRIER SUBSTRATES FOR SEMICONDUCTOR PROCESSING

A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 20×10.sup.−7/° C. to less than or equal to 120×10.sup.−7/° C. over a range from 25° C. to 500° C.

CARRIER SUBSTRATES FOR SEMICONDUCTOR PROCESSING

A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 20×10.sup.−7/° C. to less than or equal to 120×10.sup.−7/° C. over a range from 25° C. to 500° C.

Laminate assembly with embedded conductive alloy elements

A laminate assembly includes a matrix layer and elongated, continuous strips of a conductive alloy. The matrix layer has opposite first and second sides connected by opposite first and second edges. Each of the first and second edges extends from the first side of the matrix layer to the opposite second side of the matrix layer. The elongated, continuous strips of the conductive alloy are disposed in the matrix layer between the first and second sides of the matrix layer. The elongated continuous strips continuously extend through the matrix layer from the first edge to the opposite second edge.

Serration balloon

A serration balloon can have a number of different components and can be made in a number of different manners. One or more longitudinally extending members with periodic raised wedges can be attached to a medical balloon. They can be attached with a fiber coating, a polymer coating, or other methods. A polymer matrix can be used to bond the longitudinally extending member to the surface of the balloon. The fiber coating can be, for example, a thread or mesh that secures the longitudinally extending member to the balloon. The medical balloon can be an angioplasty balloon, such as an off-the-shelf angioplasty balloon.

Serration balloon

A serration balloon can have a number of different components and can be made in a number of different manners. One or more longitudinally extending members with periodic raised wedges can be attached to a medical balloon. They can be attached with a fiber coating, a polymer coating, or other methods. A polymer matrix can be used to bond the longitudinally extending member to the surface of the balloon. The fiber coating can be, for example, a thread or mesh that secures the longitudinally extending member to the balloon. The medical balloon can be an angioplasty balloon, such as an off-the-shelf angioplasty balloon.