A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler.

A repair device is a device configured to repair a plate-shaped composite material formed by laminating fiber-reinforced resin sheets. The repair device includes a main body portion that covers a portion to be repaired that is formed in an end surface configured to connect plate surfaces of the composite material so as to be recessed from the end surface such that a closed space is formed between the end surface and the main body portion, a securing portion configured to secure the main body portion to the composite material, and a resin supply portion configured to inject a resin into the closed space with a pressure. The main body portion is formed of a member with rigidity that is not deformed due to the pressure from the resin supply portion.

A repair device is a device configured to repair a plate-shaped composite material formed by laminating fiber-reinforced resin sheets. The repair device includes a main body portion that covers a portion to be repaired that is formed in an end surface configured to connect plate surfaces of the composite material so as to be recessed from the end surface such that a closed space is formed between the end surface and the main body portion, a securing portion configured to secure the main body portion to the composite material, and a resin supply portion configured to inject a resin into the closed space with a pressure. The main body portion is formed of a member with rigidity that is not deformed due to the pressure from the resin supply portion.

A method includes removing process waste from a pipe, performing at least one of inserting, pulling, and pushing a fiberglass liner that is impregnated with resin into position within the pipe, at least one of fusing and curing the fiberglass and resin liner in the pipe, and applying at least one coating of an application specific epoxy over a surface of the fiberglass and resin liner in the pipe.

A method includes removing process waste from a pipe, performing at least one of inserting, pulling, and pushing a fiberglass liner that is impregnated with resin into position within the pipe, at least one of fusing and curing the fiberglass and resin liner in the pipe, and applying at least one coating of an application specific epoxy over a surface of the fiberglass and resin liner in the pipe.

Methods and apparatus for performing repair operations using an unmanned aerial vehicle (UAV). A UAV carries a repair patch ensemble containing all repair materials (including a repair patch, a heating blanket and other ensemble materials) in a prepackaged form to the repair area. During flight of the UAV, the repair patch is vacuum adhered to the heating blanket. Vacuum pressure is also used to hold the repair patch ensemble in position on the composite surface of the structure. Then the hot bond process is enacted to bond the repair patch to the repair area. In accordance with one embodiment, the hot bond process involves heating the repair patch to adhesively bond the repair patch while applying vacuum pressure to consolidate the composite material. Then the repair patch is released from the ensemble and residual ensemble materials (heating blanket, bleeder material, and release films) are removed by the UAV.

Methods and apparatus for performing repair operations using an unmanned aerial vehicle (UAV). A UAV carries a repair patch ensemble containing all repair materials (including a repair patch, a heating blanket and other ensemble materials) in a prepackaged form to the repair area. During flight of the UAV, the repair patch is vacuum adhered to the heating blanket. Vacuum pressure is also used to hold the repair patch ensemble in position on the composite surface of the structure. Then the hot bond process is enacted to bond the repair patch to the repair area. In accordance with one embodiment, the hot bond process involves heating the repair patch to adhesively bond the repair patch while applying vacuum pressure to consolidate the composite material. Then the repair patch is released from the ensemble and residual ensemble materials (heating blanket, bleeder material, and release films) are removed by the UAV.

A kit for repairing material includes an external packaging defining an interior cavity and a repair packet inside the interior cavity. The repair packet includes a delivery layer, a frame positioned on the delivery layer, the frame being more rigid than the delivery layer and a repair material adhesively located on a first surface of the delivery substrate. A sacrificial layer is juxtaposed with the repair material such that the repair material is sandwiched between the delivery layer and the applicator layer.

A kit for repairing material includes an external packaging defining an interior cavity and a repair packet inside the interior cavity. The repair packet includes a delivery layer, a frame positioned on the delivery layer, the frame being more rigid than the delivery layer and a repair material adhesively located on a first surface of the delivery substrate. A sacrificial layer is juxtaposed with the repair material such that the repair material is sandwiched between the delivery layer and the applicator layer.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.