A method for fabricating millimeter and sub-millimeter size lenses using a high viscosity curable liquid, such as epoxy. The method comprises dispensing a predetermined volume of the curable liquid onto a substrate. The curable liquid preferably has a viscosity higher than 100 cps. Additionally, to reduce spherical aberration, the curable liquid can be cured upside down to leverage the effects of gravity.

As a first aspect, provided is a hybrid lens for which peeling and shifting of a glass and a resin lens do not easily occur, and for which floating of an adhesive layer and peeling between the glass and resin lens do not easily occur even when the hybrid lens is exposed to a high temperature environment. As a second aspect, provided is an easily produced hybrid lens in which a glass and a resin lens are laminated, and in which the resin lens and a light-shielding portion are laminated with good precision.

The hybrid lenses 11 and 12 each include a glass substrate 3, a resin lens 2, and an adhesive layer 4 provided between the glass substrate 3 and the resin lens 2. In the hybrid lens 11, the glass transition temperature of the resin lens 2 is higher than the glass transition temperature of the adhesive layer 4, and the difference between the glass transition temperature of the resin lens 2 and the glass transition temperature of the adhesive layer 4 is from 97 to 150° C. The hybrid lens 12 further includes a metal compound layer 52 provided between the glass substrate 3 and the resin lens 2.

The present invention relates to a replication tool for replicating an element from a replication material, the replication tool comprising a replication side, a plurality of cavities on the replication side, each defining the shape of one element or a group of elements, the replication tool further comprising at least one bump portion, protruding, on the replication side, from the cavities, and further comprising means for confining the replication material to a predetermined area of the tool, when the tool is pressed against a substrate, which predetermined area exceeds the desired volume of the element in at least one direction along the surface of the substrate.

An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.

A resin amount for forming each first-stage resin layer portion (a first-stage resin replica portion) 41da in a first process is defined to be greater than a resin amount for forming each second-stage resin layer portion (a second-stage resin replica portion) 41db in a second process. Therefore, at a boundary between the first-stage resin layer portion 41da and the second-stage resin layer portion 41db, a joint portion 48 at which resin overlaps is formed, whereby occurrence of an undercut shape can be avoided. Therefore, in a molding process using a sub-master die 40 and a sub-sub-master die 50 obtained from the sub-master die 40, occurrence of an undesired shape can be avoided, whereby mold release resistance can be reduced or eliminated.

An optical element including a first substrate, a second substrate, a first optical film, a second optical film, and a spacer is provided. The first optical film is disposed on the first substrate and has a first surface and a plurality of first optical microstructures. The first optical microstructures are disposed on the first surface. The second optical film is disposed on the second substrate and has a second surface and a plurality of second optical microstructures. The second surface is opposite to the first surface. The second optical microstructures are disposed on the second surface. The orthogonal projection of the first optical microstructures on the first substrate does not overlap with the orthogonal projection of the second optical microstructures on the first substrate. The spacer is disposed between the first substrate and the second substrate. A wafer level optical module adopting the optical element is also provided.

An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

An opto-electronic sensor module (e.g., an optical proximity sensor module) includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, a thermosetting polymer material, a UV-curing polymer material or a visible light-curing polymer material, wherein the separation member further includes one or more inorganic fillers and/or dyes that make the separation member substantially non-transparent to light detectable by the light detector and/or emitted by the light emitter.

This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.

To make it possible to restrain generation of chipping or cracking in a substrate of a laminated lens structure. A laminated lens structure includes substrates with lens which each have a lens disposed inside a through-hole formed in the substrate and which are laminated on one another by direct bonding, in which the substrates are each provided in the vicinity of the outer circumference thereof with through grooves penetrating the substrate. The present technology is applicable, for example, to a compound eye camera module.