An apparatus for forming a serration pattern on a light guide plate having a top surface emitting a light, a bottom surface opposite to the top surface, and at least one side surface, arranged between the top surface and the bottom surface, as an incident surface. The apparatus includes a base plate supporting the bottom surface of the light guide plate; a fixing plate facing the top surface of the light guide plate with a predetermined interval; and a serration core transferring the serration pattern onto the at least one side surface of the light guide plate by a thermal pressing process causing a thickness deformation of the light guide plate. Further, the fixing plate induces a changed thickness of the light guide plate to be uniform by limiting a thickness change amount of the light guide plate to the predetermined interval.

A method of printing a part using an additive manufacturing system includes identifying a part or parts to print and orienting a digital representation of the part(s) in a build volume. A digital representation of porous support structures for the part(s) is generated to form a digital representation of a part block of the part(s) to be printed. In the part block, a porosity of the support structure increases as a distance from an outer surface of the part increases within the print volume. The digital representation of the part block, including the part(s) and porous support structures, is sliced for printing.

A method of printing a part using an additive manufacturing system includes identifying a part or parts to print and orienting a digital representation of the part(s) in a build volume. A digital representation of porous support structures for the part(s) is generated to form a digital representation of a part block of the part(s) to be printed. In the part block, a porosity of the support structure increases as a distance from an outer surface of the part increases within the print volume. The digital representation of the part block, including the part(s) and porous support structures, is sliced for printing.

A press (1) is described, for molding an ingot made of thermoplastic or thermosetting material, comprising a basement (10) integral with risers (20), a first and a second plane (30, 40) relatively sliding with respect to the risers (20), by means of first and second hydraulic cylinders (50, 60), respectively adapted to allow opening and closing a mold formed of a first half-mold fastened to the first plane (30) and a second half-mold fastened to the second plane (40), comprising actuators (70) adapted to exert a force whose direction is equal to or opposite with respect to the direction of the force adapted to allow opening or closing the mold; the first plane (30) connected to the basement (10) is moved by means of the first hydraulic cylinders (50) and of the actuators (70), while the second plane (40) is blocked by means of a blocking apparatus (80).

In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

An object of the present invention is to improve the reliability and productivity of a semiconductor device by suppressing generation of a resin burr in a molding process. In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. Accordingly, when the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. Thus, no gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

Heat treating UHMWPE by applying pressure with radial constraint at suitable times during a heating protocol reduces or eliminates cavitation, which is otherwise observed to occur when the UHMWPE is heated to a temperature above 300 C. Heat treated UHMWPE can undergo subsequent processing involving crosslinking, deformation, doping with antioxidant, and homogenizing or annealing. Heating during these steps can be carried out even above the onset melt temperature of the UHMWPE without loss of physical properties.