Methods, apparatus and system for decorating plastic articles having an uneven surface or hollow structure are disclosed. An assembly comprising a transfer pad and a flexible heat transfer die comprising a thermal interface material (TIM) replace the hard rubber die in a hot-stamping process to fuse indicia into the surface. The assembly modifies ordinary pad printing into a hot-stamping process that transfers indicia onto uneven surfaces. A pad printing machine or other robotics is used to move the assembly from a position of heating to a position of compressing the ink transfer to the surface of the article.

Provided are a hose excelling in a lightweight property and in fatigue fracture resistance, a method for manufacturing the hose, and a hydraulic pump. The hose includes a tube, an interior of the tube being hollow, continuous carbon fibers and/or continuous glass fibers wound around an outer circumference of the tube, and a thermosetting resin present external to the tube. The thermosetting resin has an elastic modulus from 0.5 to 10 MPa, and the continuous carbon fibers and/or continuous glass fibers are impregnated with at least a part of the thermosetting resin. The elastic modulus of the thermosetting resin is a numeric value determined by: heating the thermosetting resin for 2 hours at a curing temperature of the thermosetting resin; then subjecting the thermosetting resin to thermoregulation for two weeks under a condition of a temperature of 23° C. and a relative humidity of 55%; and then performing a measurement in accordance with JIS K7161:2019.

A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (T.sub.g) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.

A method of fabricating a laminar composite article, includes steps of spreading a plurality of continuous fiber tows from a spool to form a first ply layer having a substantially consistent layer thickness, applying a binder to the spread plurality of continuous fiber tows, curing the plurality of continuous fiber tows and applied binder at a cure temperature less than a thermal decomposition temperature of the binder, and processing the cured plurality of continuous fiber tows at a post-cure temperature greater than the cure temperature.

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

Disclosed is a friction-reducing and anti-wear composite material for a wading kinematic pair and a method of preparing the same. The friction-reducing and anti-wear composite material is prepared from carbon fiber (CF) among inorganic fillers, polyimide (PI) and polyether ether ketone (PEEK). These three materials are wet-mixed, dried and placed in a mold followed by curing by a heat press. The cured product is cooled and demolded to obtain the CF/PI/PEEK friction-reducing and anti-wear composite material for a wading kinematic pair. Tribological properties of the PEEK material are enhanced due to synergistic effect arising from hybrid organic-inorganic filling. The friction-reducing and anti-wear composite material provided in the invention has significantly reduced friction coefficient and wear volume loss under the seawater environment.

In one embodiment, a powder composition can comprise polyimide particles, wherein the polyimide particles can have a glass transition temperature of not greater than 200° C. and a crystallinity of not greater than 20%. The powder composition can be adapted for forming a three-dimensional polyimide-based body in a powder-based additive manufacturing process. In one aspect, the polyimide particles can have an average particle size (D50) of at least 20 microns and not greater than 120 microns, an amount of the polyimide particles can be at least 60 wt % based on the total weight of the powder composition; and a material of the polyimide particles is a polymerization product of at least one diamine monomer and at least one dianhydride monomer.

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.