Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

A roll-to-roll method for manufacturing 2D/3D grating switch membrane is performed in such a way that: Step 1 and Step 2 are simultaneously performed, then Step 3 is performed, and finally Step 4 is performed: Step 1, subjecting a concave grating facing down to rubbing and liquid crystal dropping; Step 2, uniformly coating a PI liquid onto a surface layer of a mirror-face metal roller, and performing self-hating and rubbing; Step 3, making the concave grating rubbed and dropped with liquid crystals in Step 1 and PI layer coated and directionally-rubbed on the mirror-face metal roller in Step 2 attached to each other, forming a grating membrane, and rotating and pre-baking the grating membrane with the mirror-face metal roller; Step 4, curing the attached and baked grating membrane by the UV curing means and after stripping, collecting and winding through the 2D/3D grating switch membrane collecting roller.

A method of fabricating a thin film heater includes providing a heating element supported on a surface of a flexible dielectric backing film; and attaching a layer of heat shrink film onto the surface of the dielectric backing film so as to at least partially enclose the heating element between the heat shrink film and the dielectric backing film. The method provides a much more precise and consistent method of assembling the heater assembly and improves the thermal properties and heat transfer to a heating chamber.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

A pressure sensing system (24), seat cushion (20) incorporating the pressure sensing system, and method of sensing a weight group associated with an occupant of an automotive seat are described. The pressure sensing system includes a layer of an electrically conductive foam (28) and a flexible printed circuit (26) that includes a flexible substrate (26a) and N horizontal sensing wires (26b) and M vertical sensing wires (26c) securely placed on a top surface of the flexible substrate. The horizontal sensing wires intersect with the vertical sensing wires and form NM intersections. The layer of an electrically conductive foam is placed on top of the N horizontal sensing wires and the M vertical sensing wires. When a pressure is applied to the layer of the electrically conductive foam, each intersection generates in real time an electric flux density value to reflect a degree of a compression caused by the pressure to a corresponding point of the electrically conductive foam.

There is provided a fishing rod preventing or suppressing deviation or inclination of a fitting on a surface of a rod body. The fishing rod includes an elongated cylindrical rod body, a fitting having a mounting portion and mounted to an outer peripheral surface of the rod body via the mounting portion, a first layer formed by winding a first sheet so as to enclose the mounting portion and the rod body, the first sheet being made of a fiber-reinforced resin or a resin having a thermal shrinkage rate of 2.5% or lower, and a second layer formed by winding a second sheet made of a fiber-reinforced resin on an outer side of the first sheet, wherein a temperature at which a loss tangent of the first sheet has a maximum value is different from a temperature at which a loss tangent of the second sheet has a maximum value.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

Provided is a method for producing a composite member formed by bonding a base material and a resin member. The method includes: a surface treatment step of forming micro-order or nano-order asperities on a surface of a base material; and a bonding step of directly bonding, by injection molding, a resin member to the surface of the base material that has the asperities formed in the surface treatment step. In addition, the composite member includes: a base material having micro-order or nano-order asperities on a surface thereof; and a resin member that is in direct contact with the surface of the base material.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

A semi-finished product for the production of connection systems for electronic components comprises two groups (A, B) of alternately applied conductive layers and insulating layers, wherein outer layers (2, 2) of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems for electronic components and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area. The method for the production of connection systems for electronic components is characterized by the following steps: a) orienting two groups (A, B) of alternately applied conductive layers and insulating layers (4, 4) to face each other with outer layers to form a separation area for the groups (A, B) to be separated from each other and safeguarding that the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers (4, 4) following the separation area, b) processing the groups (A, B) of alternately applied conductive layers and insulating layer, c) cutting through the separation area along the edges thereof.