An apparatus for forming pre-shaped insulating sheets comprises a first bending station and a second bending station. The first bending station is used for bending a flat sheet of insulating material into a Z-shaped sheet (5). The second bending station is used for bending the Z-shaped sheet into an S-shape. The first and second bending stations comprise pairs of first (13a, 13b) and second bending operators for creating bending movements.

The invention relates to a mould for moulding a component with one or more inserts, the mould comprising a mould body for defining in part the shape of the component, and at least one insert holder for holding an insert within the mould body. Each insert holder is movably supported such it can move relative to the mould body in a direction of shrinkage of the component, and wherein the mould further comprises a biasing means to bias each insert holder to a first position relative to the mould body. The invention also relates to a method of moulding.

The invention relates to a method for producing a hollow electrical insulator having the following steps:—providing a core,—winding first wound layers (2) of a first fiber element onto the core,—winding second wound layers (7) of a second fiber element (8) onto an end region (10) of the core, wherein—the first wound layers (2) comprise turns of the first fiber element which include a first winding angle with a main direction of extension (R) of the core,—the second wound layers (7) comprise turns (18) of the second fiber element (8) which include a second winding angle (α2) with the main direction of extension (R) of the core, which second winding angle is larger than the first winding angle, and—an inner region (11) of the core remains free of second wound layers (7). The invention also relates to a hollow electrical insulator and the use thereof.

A method and apparatus for manufacturing a duct bank comprising the steps of loading a frame with a series of templates, positioning the frame adjacent a pipe extruder, aligning a set of a plurality of holes with a die of the pipe extruder, extruding a pipe of a first length into the set of holes, repeating the steps of aligning and extruding for each set of holes, thereby forming the duct bank, banding the duct bank, and removing the duct bank from the frame.

The present invention relates to a dry-type plug-in bushing, a manufacturing method of same, and a high-voltage installation, more specifically, to a plug-in high-voltage bushing for connecting an external electrical conductor to a high-voltage installation filled with an insulating body, and to a high-voltage installation comprising said bushing. The dry-type plug-in bushing comprises: a conducting body; a cast-type resin insulating body surrounding the conducting body; an electric field-control electrode made of a semi-conducting synthetic resin material, coupled to an upper end of a lower support fitting; the lower support fitting connected to the outer circumference of a lower part of the cast-type resin insulating body; and injected insulating body produced by an insert injection including the outer circumference of the cast-type resin insulating body and electric field-control electrode, having formed thereon a plurality of fins; and a stress cone connected to a lower end of the cast-type resin insulating body.

The present invention provides an insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a PC or PET material, the PC or PET material contains a flame retardant to meet the flame retardance and puncture resistance property thereof; a film intermediate layer located between the film upper layer and the film lower layer, the film intermediate layer is made of the blends of PP and/or PE and PC and/or PET; an upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

Provided herein according to some embodiments is polymerizable liquid useful for the production of a three-dimensional object by additive manufacturing, said polymerizable liquid comprising a mixture of: (a) at least one photopolymerizable component; (b) a photoinitiator; (c) at least one heat polymerizable component; and (d) heat expandable microspheres. A method of making a three-dimensional object from such a polymerizable liquid by additive manufacturing and objects so produced are also provided.

Provided herein according to some embodiments is polymerizable liquid useful for the production of a three-dimensional object by additive manufacturing, said polymerizable liquid comprising a mixture of: (a) at least one photopolymerizable component; (b) a photoinitiator; (c) at least one heat polymerizable component; and (d) heat expandable microspheres. A method of making a three-dimensional object from such a polymerizable liquid by additive manufacturing and objects so produced are also provided.

A method for sealing a telecommunications product is disclosed. The method includes securing a telecommunications product to an apparatus having heat blasters, and initiating a heat sealing operation that includes moving the heat blasters along a first plane toward a shrink wrap tubing until the heat blasters surround the shrink wrap tubing; delivering hot air from each heat blaster; and moving the heat blasters along a second plane along a predetermined length of the shrink wrap tubing, the second plane being orthogonal to the first plane.

A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.