Patent classifications
B29L2031/3487
HEATABLE PLASTICS COMPONENT AND METHOD FOR PRODUCING
A method for manufacturing a heatable plastic component for a motor vehicle, which includes: providing a planar heating film, which has a first surface and a second surface that faces away from and is opposite the first surface, including at least one heating wire and connecting elements; introducing the planar heating film into an injection mold; mounting a connector housing onto the connecting elements; and back-molding the first surface with a plastic for manufacturing a first partial element of the heatable plastic component in the injection mold. In order to provide an improved method for manufacturing a heatable plastic component, it is proposed that a back-molding of the second surface with a plastic for manufacturing a second partial element of the heatable plastic component in the injection mold takes place such that a composite is formed from the first partial element, the planar heating film and the second partial element.
Temperature sensors
A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.
Method for manufacturing a 3D item having an electrically conductive coil
The invention provides a method for manufacturing a 3D item (10) comprising an electrically conductive coil (140) of at least part of an electrically conductive wire (51), wherein the method comprising printing with a fused deposition modeling (FDM) 3D printer (500) 3D printable material (201), wherein the 3D printable material (201) comprises the electrically conductive wire (51), to provide the 3D item (10) comprising the electrically conductive coil (140).
Packaging device of electronic components and an encapsulation method thereof
An encapsulation method of electronic components comprises steps as follows: preparing electronic components with cylindrical bodies wherein a cylindrical body has front and rear ends made of metals and a middle end made of ceramics and the front end or the rear end features an outer diameter greater than the middle end of the cylindrical body; preparing a mould consisting of upper and lower moulds; encasing the cylindrical bodies inside the upper and lower moulds, injecting heated and softened protective materials into the mould in which protective materials as protective layers are coated on the cylindrical bodies; injecting the cylindrical bodies removed from the upper and lower moulds into a roller in which excessive protective layers on the front and rear ends of the cylindrical bodies are de-coated.
METHOD FOR MANUFACTURING A 3D ITEM HAVING AN ELECTRICALLY CONDUCTIVE COIL
The invention provides a method for manufacturing a 3D item (10) comprising an electrically conductive coil (140) of at least part of an electrically conductive wire (51), wherein the method comprising printing with a fused deposition modeling (FDM) 3D printer (500) 3D printable material (201), wherein the 3D printable material (201) comprises the electrically conductive wire (51), to provide the 3D item (10) comprising the electrically conductive coil (140).
TEMPERATURE SENSORS
A temperature sensor can include a resistor, a first electrical contact at a first end of the resistor, a second electrical contact at a second end of the resistor, and a resistance measuring device. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles. The resistance measuring device can be connected to the first electrical contact and the second electrical contact to measure a resistance of the resistor.
Three-dimensional printing
In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.
PACKAGING DEVICE OF ELECTRONIC COMPONENTS AND AN ENCAPSULATION METHOD THEREOF
An encapsulation method of electronic components comprises steps as follows: preparing electronic components with cylindrical bodies wherein a cylindrical body has front and rear ends made of metals and a middle end made of ceramics and the front end or the rear end features an outer diameter greater than the middle end of the cylindrical body; preparing a mould consisting of upper and lower moulds; encasing the cylindrical bodies inside the upper and lower moulds, injecting heated and softened protective materials into the mould in which protective materials as protective layers are coated on the cylindrical bodies; injecting the cylindrical bodies removed from the upper and lower moulds into a roller in which excessive protective layers on the front and rear ends of the cylindrical bodies are de-coated.
THREE-DIMENSIONAL PRINTING
In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.
MANUFACTURING METHOD OF SHUNT RESISTOR AND MANUFACTURING METHOD OF SHUNT RESISTOR ASSEMBLY
Disclosed are a manufacturing method of a shunt resistor and a manufacturing method, in which a resistor element and connection pieces may be bonded through laser or electron beam welding so as to prevent welding distortion as much as possible, and measurement terminals may be manufactured by a simple pressing and bending process.