Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.

An elastic membrane having a physical property required for each portion of the elastic membrane and capable of uniformly polishing a workpiece is disclosed. The elastic membrane includes: a contact portion having a workpiece pressing surface for pressing a workpiece against a polishing surface; and a partition wall extending upward from the contact portion and forming a pressure chamber. The contact portion and at least a part of the partition wall are composed of a first rubber structure and a second rubber structure which are integrally formed, the first rubber structure has a first hardness, and the second rubber structure has a second hardness lower than the first hardness, the first rubber structure includes the workpiece pressing surface, and the second rubber structure includes the at least a part of the partition wall.

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.

A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.

Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is prepared by extruding a compounded photopolymerizable composition followed by exposure to UV light.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.