Patent classifications
B29L2031/7736
Method to suppress period doubling during manufacture of micro and nano scale wrinkled structures
The range of stretch-tunability of sinusoidal wrinkled surfaces that are obtained by compression of supported thin films is limited by the emergence of a period-doubled mode at high compressive strains. This disclosure presents a method to suppress the emergence of the period-doubled mode at high strains. This is achieved by compressing pre-patterned supported thin films, wherein the pre-patterns are substantially similar to the natural pattern of the supported thin film system. As compared to flat thin film systems, pre-patterned thin film systems exhibit period doubling behavior at a higher compressive strain. The onset strain for emergence of period-doubling is tuned by altering the amplitude of the pre-patterns.
Method to suppress period doubling during manufacture of micro and nano scale wrinkled structures
The range of stretch-tunability of sinusoidal wrinkled surfaces that are obtained by compression of supported thin films is limited by the emergence of a period-doubled mode at high compressive strains. This disclosure presents a method to suppress the emergence of the period-doubled mode at high strains. This is achieved by compressing pre-patterned supported thin films, wherein the pre-patterns are substantially similar to the natural pattern of the supported thin film system. As compared to flat thin film systems, pre-patterned thin film systems exhibit period doubling behavior at a higher compressive strain. The onset strain for emergence of period-doubling is tuned by altering the amplitude of the pre-patterns.