A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

A tip including an alloy of platinum and an alloying element chosen from gold, palladium, ruthenium, osmium, iron, cobalt, nickel, copper, zinc, silver, chromium, manganese, titanium, niobium, scandium, vanadium, yttrium, zirconium, molybdenum, tantalum, tungsten, technetium, cadmium, hafnium, rhenium, less than 5 wt. % of iridium, less than 5 wt. % of rhodium, greater than 20 wt. % iridium, greater than 20 wt. % rhodium, and a combination thereof, relative to the total weight of the alloy is disclosed. An interface cone can include a base and the tip.

Platinum-based alloys comprising a second element are generally described. In some embodiments, the platinum-based alloy may comprise a third element.

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

The present disclosure relates to a structural coating and preparation method and use thereof. The structural coating provided in the present disclosure includes a titanium transition layer and platinum-hafnium composite structure layers laminated in sequence on a surface of a substrate; the number of the platinum-hafnium composite structure layer is ≥3; the platinum-hafnium composite structure layer includes a hafnium layer and a platinum layer laminated in sequence.

The present invention is to provide a plating film which can improve soldering bond reliability of solder bond against the accumulation of thermal history.

The present invention is a multilayer plating film comprising an electroless nickel-germanium alloy plating film; an electroless palladium plating film; and an electroless gold plating film in this order.

An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 μm or less/10 μm or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.

A silver-plated product which has more excellent minute sliding abrasion resistance property than that of conventional silver-plated products, and a method for producing the same. The silver-plated product is produced by electroplating a base material 10 of copper or a copper alloy to form an underlying plating layer 12 of nickel or a nickel alloy, a first silver-plating layer of silver (lower silver-plating layer) 14, a zinc-plating layer 16 of zinc serving as an intermediate plating layer, and a second silver-plating layer of silver (upper silver-plating layer) 18 serving as a surface layer, in this order from the base material 10.

This copper alloy for electronic or electric devices contains 100 mass ppm or greater and 400 mass ppm or less of Mg, 5 mass ppm or greater and 20 mass ppm or less of Ag, and less than 5 mass ppm of P with a balance being Cu and inevitable impurities, in which when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NF.sub.J3 and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NF.sub.J2, an expression of 0.22<(NF.sub.J2/(1−NF.sub.J3)).sup.0.5≤0.45 is satisfied.

Coated articles and methods for applying coatings are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.