One aspect of the invention provides a composite refrigeration line set including at least one selected from the group consisting of: a suction line and a return line, characterized in that one or more of the suction line and the return line are a composite refrigeration line set tube include: an inner plastic tube; a first adhesive layer positioned about the inner plastic tube; an aluminum layer positioned about the first adhesive layer and coupled to the inner plastic tube via the first adhesive layer; a second adhesive layer positioned about the aluminum layer; and an outer plastic layer positioned about the aluminum layer coupled to the aluminum layer via the second adhesive layer. The inner plastic tube is polyethylene of raised temperature. The outer plastic tube is polyethylene of raised temperature. The aluminum layer comprises AL 3005-O.

One aspect of the invention provides a system including: a length of energy-dissipative tubing; a first sealing device coupled to a first end of the length of energy-dissipative tubing; and a second sealing device coupled to a second end of the length of energy-dissipative tubing. Exposure to one or more selected from the group consisting of: fault currents or lightning strikes at an exposure point along the length of energy-dissipative tubing will produce arcs at the exposure point and at least one of the first end and the second end.

A battery pack and an electric vehicle are provided. The battery pack includes a battery sequence. The battery sequence includes multiple cells. A thickness of each cell extends along a first direction. The multiple cells are arranged in sequence along the first direction to form the battery sequence. At least one of the cells includes a metal shell and an electrode core packaged in the metal shell. An air pressure inside the metal shell is lower than an air pressure outside the metal shell. A gap is provided between at least two adjacent cells. A ratio of the gap to the thickness of the cell ranges from 0.001 to 0.15.

The invention comprises a peelable membrane for resealably closing a metal end comprising an outer layer, a tacky layer, and a heat seal layer. The heat seal layer is permanently sealed to the metal end to cover at least one opening in the metal end. The tacky layer causes the peelable membrane to be resealable onto the metal end.

The invention comprises a peelable membrane for resealably closing a metal end comprising an outer layer, a tacky layer, and a heat seal layer. The heat seal layer is permanently sealed to the metal end to cover at least one opening in the metal end. The tacky layer causes the peelable membrane to be resealable onto the metal end.

Described herein is a process for preparing a flexible packaging material. The process may comprise: providing a printed first flexible substrate comprising an ink composition on a surface of a first flexible substrate, the ink composition comprising a first thermoplastic resin; depositing a further composition comprising a cross-linker, a white pigment and a second thermoplastic resin onto the printed ink composition such that the thermoplastic resin of the ink composition is cross-linked; and laminating the first flexible substrate with a second flexible substrate such that the ink composition, the further composition and the cross-linker are disposed between the first and second flexible substrates.

The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape.

The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape.

A seamless tubular liner for repairing an underground or surface pipe is disclosed, including circumferential wefts consisting of slivers comprising a plurality of staple fibers bundled together, the slivers adapted to elongate through disentanglement of the bundled staple fibers when the seamless tubular liner is subjected to an inflation pressure such that the diameter of the tubular liner is able to expand to accommodate variations of diameter of the pipe being repaired.

The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.