Patent classifications
B32B15/092
Multifunctional surfacing films
The present invention is directed to multifunctional surfacing films each comprising: (a) a single layer of curable polymer composition having opposing first and second surfaces: (b) a peelable porous sheet disposed at or beneath the second surface; and (d) at least one porous sheet of functional material disposed within the single layer of curable polymer composition and positioned between the first surface and the peelable porous sheet, and methods of making and using such multifunctional surfacing films.
Lightning strike protection
The present disclosure is directed to an exterior surface protective layer for protecting a composite structure from environmental conditions including: at least one curable film; such as at least two curable films, and an electrically conductive material, wherein the electrically conductive material comprises a wire-free electrically conductive material, and/or an electrically conductive polymer weave, wherein the at least one curable film includes at least one of polyurethane, polyimide, polyester or epoxy upon curing, and wherein a weight of the exterior surface protective layer ranges from about 0.02 pounds per square foot to about 0.1 pounds per square foot. An exterior surface protected composite structure and methods of forming an exterior surface protected composite structure are also provided.
Resin composition and use thereof
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.
Resin composition and use thereof
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.
LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD
A laminate includes: a base material; a circuit; an insulating layer provided between the base material and the circuit, the insulating layer including a thermally conductive filler; and an adhesive configured to bond at least the base material and the insulating layer. The base material and the insulating layer are bonded by the adhesive in part and in contact with each other in other parts. A plurality of spaces are formed in the insulating layer, and the adhesive fills at least a portion of the plurality of spaces.
LAMINATED SHEET FOR METAL-CLAD LAMINATE, METHOD OF MANUFACTURING LAMINATED SHEET FOR METAL-CLAD LAMINATE, METAL-CLAD LAMINATE, AND METHOD OF MANUFACTURING METAL-CLAD LAMINATE
An object of the present invention is to provide a laminated sheet for a metal-clad laminate and a method of manufacturing the same, the laminated sheet including: a substrate that includes a liquid crystal polymer or a fluoropolymer; and an adhesive layer, in which adhesiveness with a metal layer formed on the adhesive layer is excellent. Another object of the present invention is to provide a metal-clad laminate and a method of manufacturing the same.
A laminated sheet for a metal-clad laminate includes: a substrate that includes a liquid crystal polymer or a fluoropolymer; an inorganic oxide layer; and an adhesive layer, in which the substrate, the inorganic oxide layer, and the adhesive layer are laminated in this order.
Metal resin composite-molded article and method for manufacturing same
A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.
DISPLAY APPARATUS
Provided is a display apparatus including a display panel that is capable of being rolled up, and a protection member, the protection member including a back surface portion layered closer to a back surface of the display panel, a first folded portion folded toward a front surface of the display panel from one end of the back surface portion in an orthogonal direction orthogonal to a roll-up direction in which the display panel is rolled up, and a second folded portion folded toward the front surface from another end of the back surface portion in the orthogonal direction. In the display apparatus, the first folded portion includes a first front surface portion arranged at one end of the front surface in the orthogonal direction, and the second folded portion includes a second front surface portion arranged at another end of the front surface in the orthogonal direction.
Insulation sheet, laminate, and substrate
An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.
Insulation sheet, laminate, and substrate
An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.