In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

An acoustic structure presenting a front surface and a back surface is provided. The acoustic structure includes a support layer comprising the back surface, a honeycomb core comprising a thickness defined between a back and a front, and a plurality of walls that define a plurality of honeycomb cells, wherein the plurality of honeycomb cells extend through the thickness of the honeycomb core opening out toward at least the front, and wherein the back of the honeycomb core is affixed to the support layer, a mesh layer affixed to the front of the honeycomb core, and a knit fabric layer affixed to the mesh layer and conforming to the front surface of the acoustic structure.

Disclosed is a bonded assembly comprising at least: a first substrate, a second substrate, an intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which cavities are provided so that the intermediate deformation layer has a stiffness which is variable along a direction parallel to the intermediate deformation layer, an adhesive between the intermediate layer and the second substrate.

A seamless tubular liner for repairing an underground or surface pipe is disclosed, including circumferential wefts consisting of slivers comprising a plurality of staple fibers bundled together, the slivers adapted to elongate through disentanglement of the bundled staple fibers when the seamless tubular liner is subjected to an inflation pressure such that the diameter of the tubular liner is able to expand to accommodate variations of diameter of the pipe being repaired.

The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1):

##STR00001##

wherein a plurality of R each independently represent any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.

The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1):

##STR00001##

wherein a plurality of R each independently represent any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

A moisture-curable polyurethane hot melt adhesive composition having good oleic acid resistance, especially when exposed to 100% pure oleic acid under aging condition of 65° C. and 90% relative humidity, wherein the adhesive composition comprises, consists essentially of or consists of a moisture-curable polyurethane prepolymer, the prepolymer being a reaction product of at least one amorphous polyester polyol containing an aromatic group and at least one polyisocyanate, preferably at least one polyisocyanate containing an aromatic group, wherein the aromatic group is comprised in the polyurethane prepolymer in a content of no less than 23 wt. %, preferably no less than 25 wt. %, more preferably no less than 30 wt. %.