A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

One aspect of the invention provides a composite refrigeration line set including at least one selected from the group consisting of: a suction line and a return line, characterized in that one or more of the suction line and the return line are a composite refrigeration line set tube include: an inner plastic tube; a first adhesive layer positioned about the inner plastic tube; an aluminum layer positioned about the first adhesive layer and coupled to the inner plastic tube via the first adhesive layer; a second adhesive layer positioned about the aluminum layer; and an outer plastic layer positioned about the aluminum layer coupled to the aluminum layer via the second adhesive layer. The inner plastic tube is polyethylene of raised temperature. The outer plastic tube is polyethylene of raised temperature. The aluminum layer comprises AL 3005-O.

A vehicle cargo construct includes a floor, a plurality of side wall panels extending from the floor, and an end wall panel extending from the floor between the plurality of side wall panels. The floor has an upper surface and an oppositely opposed lower surface. Each of the plurality of side wall panels has an exterior surface and an oppositely opposed interior surface. The end wall panel has an exterior surface and an oppositely opposed interior surface. Each of the floor, the plurality of side wall panels, and the end wall panel being formed of a composite sandwich panel material formed of an open area core defining a plurality of pores, a surface sheet adhered to a first face of the open area core by a first adhesive layer, and a structural skin adhered to a second face of the open area core by a second adhesive layer.

The invention relates to an An acoustic protection system for a motor vehicle has two walls extending opposite each other; an elastically compressible acoustic decoupling layer arranged in compression at least along its periphery between the walls, the layer having two opposing faces pressed respectively against each of the walls, the faces being connected to each other by an edge, the layer being enclosed in a bag made from plastic film closed so as to form a sealed barrier on the edge, at least one air passage hole being provided in the bag opposite at least one of the faces, the hole being arranged at a distance from the edge so as to provide, around the hole, a seal created by the bag bearing on the corresponding wall.

The invention relates to an An acoustic protection system for a motor vehicle has two walls extending opposite each other; an elastically compressible acoustic decoupling layer arranged in compression at least along its periphery between the walls, the layer having two opposing faces pressed respectively against each of the walls, the faces being connected to each other by an edge, the layer being enclosed in a bag made from plastic film closed so as to form a sealed barrier on the edge, at least one air passage hole being provided in the bag opposite at least one of the faces, the hole being arranged at a distance from the edge so as to provide, around the hole, a seal created by the bag bearing on the corresponding wall.

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

An acoustic structure presenting a front surface and a back surface is provided. The acoustic structure includes a support layer comprising the back surface, a honeycomb core comprising a thickness defined between a back and a front, and a plurality of walls that define a plurality of honeycomb cells, wherein the plurality of honeycomb cells extend through the thickness of the honeycomb core opening out toward at least the front, and wherein the back of the honeycomb core is affixed to the support layer, a mesh layer affixed to the front of the honeycomb core, and a knit fabric layer affixed to the mesh layer and conforming to the front surface of the acoustic structure.

Materials and methods for mitigating passive intermodulation. A membrane for reducing passive intermodulation includes a first polymeric layer, a second polymeric layer, and a continuous metal layer encapsulated between the first and second polymeric layers. A self-adhesive radio frequency barrier tape includes a waterproof polymeric top layer, a metal-containing layer adhered by an adhesive layer to the polymeric top layer, a pressure sensitive adhesive layer adhered to the metal-containing layer, and a release liner on a bottom surface of the pressure sensitive adhesive layer. A method of mitigating passive intermodulation includes passing a probe over an area of interest, the probe being sensitive to an intermodulation frequency of interest, and identifying a suspected source of passive intermodulation when the amplitude of the probe output exceeds a threshold at the frequency of interest. The method further includes covering the suspected passive intermodulation source with a radio frequency barrier material.

A belt for creping a web in a papermaking process. The belt includes a surface onto which the web is transferred during the papermaking process. A plurality of openings extend through the surface, with the openings being arranged in lines that are offset from lines in the machine direction (MD) and cross-machine direction (CD) of the belt. Paper products, such as absorbent sheets, made from the belt have hollow dome regions and connecting regions between the domes, with the domes being arranged in lines that are offset from lines in the MD and CD of the paper products.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.