A method of detecting defects in a composite layup includes capturing, using an infrared camera, reference images of a reference layup being laid up by a reference layup head. The method also includes manually reviewing the reference images for defects, and generating reference defect masks indicating defects in the reference images. The method further includes training, using the reference images and reference defect masks, a neural network, creating a machine learning model that, given a production image as input, outputs a production defect mask indicating the defect location and the defect type of each defect. The method also includes capturing, using an infrared camera, production images of a production layup being laid up by the production layup head, and applying the model to the production images to automatically generate a production defect masks indicating each defect in the production images.

A glue jamming prevention structure of a laminator is disclosed, having a main structure that includes a housing, an entry opening and an out-feeding opening respectively arranged at two sides of the housing, a left side board, a right side board, and a power element arranged in the housing. A first entry driving axle, a second entry driving axle, a first out-feeding driving axle, a second out-feeding driving axle, a left-side elastic assembly, and a right-side elastic assembly are arranged on the left side board and the right side board. A first driving belt is arranged on the first entry driving axle and the first out-feeding driving axle. A second driving belt is arranged on the second entry driving axle and the second out-feeding driving axle.

A method is provided for manufacturing flooring planks including a plastic base and an image plastic layer. The method includes a feeding step of feeding a plastic layer into oppositely rolling rollers; and a rolling step of hot rolling an embossing on the plastic layer. A feeding tension of the plastic layer is adjusted according to a longitudinal deviation between the embossing and the pattern in the rolling step. A device includes a first feeding device, an oppositely rolling rollers control device, a detecting device, and a tension controller disposed on the first feeding device. The method, the device and the long plastic layer with the embossing in register with the pattern processed use the method, implement the embossing rolled on the plastic layer in register with the pattern on the plastic layer and have high production efficiency, low cost and less energy consumption.

A unit plate position fixation method and device and a lamination machine are provided. The unit plate position fixation method includes: obtaining peripheral position information of unit plates located between two layers of separators; controlling a hot-pressing device according to the peripheral position information to perform hot pressing on the two layers of separators, so that the two layers of separators are adhered at peripheral positions of the unit plates.

A lamination device that laminates a plurality of types of workpieces includes a plurality of supply mechanisms that supply a workpiece to each of a plurality of supply positions, a movement mechanism including a stator of a linear motor having a predetermined traveling track and a mover of a linear motor that is movable between a plurality of the supply positions along a traveling track, and a control unit that controls at least the mover. The mover includes a lamination stage for laminating the workpiece. The control unit corrects a relative position of the workpiece supplied to the supply positions with respect to the lamination stage, laminates the workpiece whose relative position is corrected on the lamination stage, and controls the mover so as to move to a next one of the supply positions after lamination of the workpiece.

A long plastic layer with an embossing in register with a pattern, a rolling method and a device are described herein. The method comprises a feeding step of feeding a plastic layer into oppositely rolling rollers; and a rolling step of hot rolling an embossing on the plastic layer. A feeding tension of the plastic layer is adjusted according to a longitudinal deviation between the embossing and the pattern in the rolling step. The device comprises a first feeding device, an oppositely rolling rollers control device, a detecting device, and a tension controller disposed on the first feeding device. According to the long plastic layer with the embossing in register with the pattern manufactured by the method, the embossing on the plastic layer is in register with the pattern on the plastic layer. The present invention provides the method, the device and the long plastic layer with the embossing in register with the pattern processed using the method, implementing the embossing rolled on the plastic layer in register with the pattern on the plastic layer and having high production efficiency, low cost and less energy consumption.

An apparatus and method for leveling a bonding device and anvil in an assembly via a closed-loop control system is provided. The assembly includes an anvil, a bonding device positioned adjacent the anvil and configured to interact with the anvil to form the bonds on the web, and an actuator that enables adjustment of an orientation between the bonding device and the anvil. The assembly also includes a closed-loop control system configured to control operation of the actuator, with the closed-loop control system configured to monitor an operational parameter of the assembly indicative of interaction of the bonding device with the anvil, determine whether the bonding device is parallel or substantially parallel with the anvil based on the operational parameter, and when the bonding device is not parallel or substantially parallel with the anvil, cause the actuator to adjust the orientation between the bonding device and the anvil.

A component assembly includes a core including a main body having a first surface and a second surface opposite from the first surface. One or more recessed cells are formed in each of the first surface and the second surface of the main body. The one or more recessed cells formed in the first surface extend toward the second surface. The one or more recessed cells formed in the second surface extend toward the first surface. A first layer is secured to the core at a first adhesive layer. A second layer is secured to the core at a second adhesive layer.

Systems and methods for semi-discrete modeling of delamination migration in composite laminate materials are disclosed. An example method includes receiving a specimen geometry and a specimen stacking sequence. The example method also includes creating a finite-element (FE) mesh that defines a composite laminate material by: generating, using a mesh generation tool, a plurality of plies shaped according to the specimen geometry, and connecting the plies together based on the stacking sequence by placing cohesive elements between each adjacent pair of plies. The example method also includes determining a predicted mechanical response of the composite laminate material by: generating a constitutive model corresponding to the composite laminate material based on the FE mesh, and inputting a strain value to the constitutive model to generate the predicted mechanical response.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.