A manufacturing method including a first conveying step of conveying the sheet in a lateral or oblique lateral direction along a sheet pass line below the discharge port; a receiving step of receiving a tip part of the film raw material with the sheet on the sheet pass line, the tip part being discharged and hanging down from the discharge port; a second conveying step of conveying the sheet and the film raw material after the tip part overlaps the sheet on the sheet pass line, the second conveying step conveying the sheet and the film raw material in a mutually overlapping state along the sheet pass line; and an introducing step of introducing the sheet and the film raw material in the mutually overlapping state to the joining part from the sheet pass line.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

The invention relates to an applicator for die-cut parts (2), having a die-cut part strip (1) with a longitudinal direction (L) having a carrier layer (3) and an adhesive layer (4), where an outer contour of the die-cut parts (2) is punched through the carrier layer and adhesive layer (3, 4) down to predetertnined breaking points (18) and a die-cut part complement (19) protrudes beyond the die-cut parts (2) continuously laterally to a longitudinal direction (L), and a punch head (8) over which the die-cut part strip (1) runs, where the die-cut parts (2) running over the punch head (8) face away from the punch head (8) by their adhesive layer (4), and the die-cut parts (2) can be pressed by means of the punch head (8) onto a surface (11).

An optical bonding machine is provided, including a transparent datum located within the optical bonding machine, wherein the transparent datum supports a first substrate, a robotic placement head configured to pick up a second substrate and place the second substrate into contact with the first substrate, on the transparent datum, a camera disposed proximate the transparent datum, the camera capturing a video of a flow of an optically clear adhesive between the first substrate and the second substrate, and a curing source disposed proximate the transparent datum, the curing source emitting UV rays that pass through the transparent datum and the first substrate to cure an optically clear adhesive between a bonded substrate comprising the first substrate, the optically clear adhesive, and the second substrate. An associated method is also provided.

The present disclosure relates to a method for teaching and/or operating a laminating method and/or laminating device for laminating a film element on a substrate part, in which designated working positions, designated intermediate positions and/or designated end positions into which grippers for gripping the film element are subsequently moved to laminate the film element, are determined and taught by with the aid of CAD data of the substrate part and/or the film element.

A manufacturing method including a first conveying step of conveying the sheet in a lateral or oblique lateral direction along a sheet pass line below the discharge port; a receiving step of receiving a tip part of the film raw material with the sheet on the sheet pass line, the tip part being discharged and hanging down from the discharge port; a second conveying step of conveying the sheet and the film raw material after the tip part overlaps the sheet on the sheet pass line, the second conveying step conveying the sheet and the film raw material in a mutually overlapping state along the sheet pass line; and an introducing step of introducing the sheet and the film raw material in the mutually overlapping state to the joining part from the sheet pass line.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

An optical bonding machine is provided, including a transparent datum located within the optical bonding machine, wherein the transparent datum supports a first substrate, a robotic placement head configured to pick up a second substrate and place the second substrate into contact with the first substrate, on the transparent datum, a camera disposed proximate the transparent datum, the camera capturing a video of a flow of an optically clear adhesive between the first substrate and the second substrate, and a curing source disposed proximate the transparent datum, the curing source emitting UV rays that pass through the transparent datum and the first substrate to cure an optically clear adhesive between a bonded substrate comprising the first substrate, the optically clear adhesive, and the second substrate. An associated method is also provided.

The invention relates to an applicator for die-cut parts (2), having a die-cut part strip (1) with a longitudinal direction (L) having a carrier layer (3) and an adhesive layer (4), where an outer contour of the die-cut parts (2) is punched through the carrier layer and adhesive layer (3, 4) down to predetertnined breaking points (18) and a die-cut part complement (19) protrudes beyond the die-cut parts (2) continuously laterally to a longitudinal direction (L), and a punch head (8) over which the die-cut part strip (1) runs, where the die-cut parts (2) running over the punch head (8) face away from the punch head (8) by their adhesive layer (4), and the die-cut parts (2) can be pressed by means of the punch head (8) onto a surface (11).

Apparatus and method disclosed herein are used in a production facility including an inventory of base substrates and laminates used in the production of graphics, the production facility further including at least one printer and at least one laminating machine. Base substrates, such as adhesive backed vinyl films, and laminates are received at the facility and labeled to be identified in a production process. Project data stored in a data storage system, and data concerning the substrates and laminates, is used by a production control system to control the process of printing graphic images on the substrate, and laminate the substrate.