The present disclosure is directed to a physically crosslinked, closed cell continuous multilayer foam structure comprising at least one foam polypropylene/polyethylene layer with a KEE cap layer. The multilayer foam structure can be obtained by coextruding a multilayer structure comprising at least one foam layer composition layer with at least one cap layer composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

The present disclosure is directed to a physically crosslinked, closed cell continuous multilayer foam structure comprising at least one foam polypropylene/polyethylene layer with a KEE cap layer. The multilayer foam structure can be obtained by coextruding a multilayer structure comprising at least one foam layer composition layer with at least one cap layer composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

A composite board comprising (i) a first foam region; (ii) at least one fragile insulating material; and (iii) a second foam region, where said second foam region is substantially devoid of hydrocarbons.

The present invention provides a structure that improves sound absorption coefficient. The present invention provides a structure comprising: a foam resin layer formed of a foam material having a foaming ratio of 1.1 to 8 times; and a sound absorbing layer formed of a foam material having a foaming ratio of 10 to 30 times, the sound absorbing layer laminated on the foam resin layer.

The present invention relates to a thermal insulation board (IB) comprising at least two insulating layers (A) bonded together. At least one of the at least two insulating layers (A) comprises at least one aerogel composite material, wherein the aerogel composite material comprises at least one silica aerogel (a1), at least one polymer foam (a2) and at least one flame retardant (a3). The present invention also relates to a thermal insulation system (IS) comprising the thermal insulation board (IB). Further, it relates to a process for the production of the thermal insulation board (IB) and to the use of the thermal insulation board (IB) and of the thermal insulation system (IS) for the thermal insulation of buildings, parts and/or elements of buildings.

The present disclosure relates to a composite membrane formed by lamination of two or more separate porous polymeric layers, as well as to a method and system for lamination. Advantageously, the resulting composite is a single layer, being difficult to separate into its component layers, yet effectively maintains the filtering capabilities of the component layers when not laminated.

A method is described for debonding a bonded article. The bonded article comprises at least two components which are bonded to one another by means of a polyurethane adhesive selected from aqueous polyurethane dispersion adhesives and polyurethane hotmelt adhesives. At least one of the components is a thermoplastic polyurethane. The components are debonded by treatment with an aqueous surfactant composition at elevated temperatures.

The present disclosure provides a cellular foam composition, a method for producing and using the same. One particular aspect of the disclosure provides a cellular foam composition comprising a plurality of foam layers, where each foam layer is made from a hollow microstructure material. In particular, the density of the hollow microstructure material in each foam layer is different from the density of the hollow microstructure material that forms the adjacent foam layer. In some embodiments, cellular foam compositions of the disclosure further include an interfacial layer comprising interfacial voids in between adjacent layers.

A soundproofing material including a porous body having a cell structure and including inorganic fibers other than asbestos, wherein an average cell diameter is more than 300 μm and 1000 μm or less, a bulk density is 0.007 to 0.024 g/cm.sup.3, and a flow resistivity is 170,000 to 2,000,000 Ns/m.sup.4.

The present disclosure is directed to dielectric elastomeric composites that include a retainable processing membrane, an elastomer material, and an electrically conductive material. The elastomer layer may be partially imbibed into the retainable processing membrane. The retainable processing membrane may be porous. The retainable processing membrane is compacted in the transverse in direction, machine direction, or in both directions prior to the application of an elastomer material and an electrically conductive material. The compaction of the retainable processing membrane may form structured folds or folded fibrils in the membrane, giving the retainable processing membrane a low modulus and flexibility. In some embodiments, the dielectric composites are positioned in a stacked configuration. Alternatively, the dielectric elastomeric composites may have a wound configuration. The dielectric composites have a total thickness less than about 170 μm. The dielectric elastomeric composites may be used, for example, in dielectric elastomer actuators, sensors, and in energy harvesting.