B32B2255/06

HEAT-REFLECTIVE BLANK AND CONTAINER AND METHOD OF FORMING A HEAT-REFLECTIVE BLANK AND CONTAINER
20180009593 · 2018-01-11 ·

A method for forming a heat-reflective blank includes laminating at least one thermal film sheet at a predetermined position on a first linerboard sheet such that a laminated sheet is formed, and feeding the laminated sheet into a corrugating machine. The method further includes coupling the laminated sheet to a corrugated medium sheet and a second linerboard sheet such that a corrugated sheet is formed. The corrugated medium sheet is between the first linerboard sheet and the second linerboard sheet and the thermal film sheet is positioned on an outer surface of the corrugated sheet.

LAMINATED PACKAGING MATERIAL COMPRISING ALUMINUM WITH IMPROVED RECYCLABILITY
20230234337 · 2023-07-27 ·

The present invention relates generally to the field of laminated packaging. In particular, the present invention relates to laminated flexible packaging comprising aluminium and a plastic sealant layer only on one side of the aluminium. One embodiment of the present invention relates to a laminated flexible packaging made at least in part from a laminated flexible packaging material comprising an aluminium foil layer, a plastic sealant layer and a coating, wherein the aluminium foil layer is laminated to the plastic sealant layer on the side facing the packaged product, the other side of the aluminium foil layer is coated with the coating but not laminated to a layer of plastic or paper, and wherein the laminated flexible packaging is manufactured from the laminated flexible packaging material on a horizontal form fill and seal (HFFS) machine.

HEAT EQUALIZATION PLATE
20230240045 · 2023-07-27 ·

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

CMAS-RESISTANT ENVIRONMENTAL BARRIER AND THERMAL BARRIER COATINGS
20230002288 · 2023-01-05 ·

In some examples, an article for a high-temperature mechanical system including a substrate and a doped calcia-magnesia-alumina-silicate resistant (doped CMAS-resistant) layer on the substrate. The doped CMAS-resistant layer is a thermal barrier coating or an environmental barrier coating and includes a calcia dopant.

COMPOSITE FILM AND PRODUCTION THEREOF USING A COATING FACILITY

The invention relates to a method for producing a composite film with a polyurethane-based reactive hot-melt layer using a coating facility, having the steps of a) optionally applying a primer onto a support material; b) applying the polyurethane-based reactive hot-melt layer onto the primer or directly onto the support material; c) applying a lacquer layer onto the polyurethane-based reactive hot-melt layer in order to produce the composite film on the support material; d) optionally embossing the composite film on the support material; and e) separating the composite film from the support material. The invention additionally relates to a composite film which can be obtained by such a method and to the use thereof.

RESIN COATED COPPER AND CIRCUIT BOARD INCLUDING THE SAME
20230240008 · 2023-07-27 ·

A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.

POLYAMIDE-METAL LAMINATES
20230001669 · 2023-01-05 ·

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

LAYERED COMPOSITE

[Object]

The purpose of the present invention is to provide a layered composite that is high in both flexural modulus and moldability.

[Solving Means]

Provided is a layered composite including a carbon-fiber-reinforced resin in which a chopped strand prepreg obtained by impregnating fiber in resin is oriented in such a manner as to exhibit pseudo-isotropic properties, and a steel plate that is layered on at least one surface of the carbon-fiber-reinforced resin and has a tensile breakage elongation ϕ of equal to or more than 20%, the flexural modulus in a flat plate state obtained in compliance with ASTM D-790 being equal to or more than 30 GPa.

Functionalized Textile Compositions and Artilces
20230002960 · 2023-01-05 ·

Functionalized textile materials are provided. At least a portion of a textile surface in includes a ceramic material, such as a binderless porous structured ceramic, and optionally, one or more functional layer is applied, resulting in a textile material with one or more desirable functional properties, such as hydrophilicity, hydrophobicity, flame retardancy, photocatalysis, anti-fouling, and/or deodorant properties.

BONDING SHEET AND BONDED STRUCTURE
20230005871 · 2023-01-05 ·

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.