B32B2264/1024

FILMS HAVING SPECIAL PROPERTIES

The invention relates to a film containing a special polycarbonate or copolycarbonate of the formula (Ia), (I-2), (I-3) or (I-4) and to the use of the film in a security document and in a layer structure.

COMPOSITES AND METHODS OF FORMING COMPOSITES HAVING TAILORED HARDNESS PROFILE
20230234331 · 2023-07-27 · ·

An aerospace component may comprise a fiber reinforced composite material. The fiber reinforced composite material includes a plurality of fiber layers and a carbon matrix surrounding the plurality of fiber layers. A plurality of ceramic particles is dispersed in the carbon matrix. A first fiber layer of the plurality of fiber layers may include a carbon fiber, and a second fiber layer of the plurality of fiber layers may include a non-carbon fiber. A hardness of the non-carbon fiber is greater than a hardness of carbon fiber.

Moisture barrier laminate

An object of the present invention is to provide a moisture barrier laminate including a moisture trapping layer that maximizes its moisture trapping performance and exhibits an excellent moisture barrier property. The moisture barrier laminate of the present invention includes a gas barrier film substrate A having a gas barrier layer a1 and a moisture trapping layer B formed on the film substrate A as a base. On a surface of the moisture trapping layer B opposite to the film substrate A, a protective resin layer C having a moisture permeability in a range of 4.0×10 to 5.0×10.sup.4 g/m.sup.2.Math.day at 40° C. and 90% RH is laminated.

YSZ CERAMIC SUBSTRATE PROTECTED FIREPROOF HOSE
20230028634 · 2023-01-26 ·

A hose is provided capable of meeting fireproof requirements per AS1055 under no flow condition. The hose has multiple layers including a yttria-stabilized zirconia (YSZ) flexible ceramic substrate layer disposed between first and second silicone rubber layers.

Method for Manufacturing Silicon Nitride Substrate
20220371963 · 2022-11-24 ·

The present invention relates to a method for manufacturing a silicon nitride substrate and, more specifically, comprises the steps of: forming a slurry by mixing silicon nitride powder, a ceramic additive, and a solvent; molding the slurry to form sheets; sandwiching at least one of the sheets between a lower plate and an upper plate to form a stacked structure; degreasing the stacked structure; and sintering the stacked structure. At least one of the lower plate and the upper plate comprises a plurality of protrusions provided on one surface thereof, and the protrusions extend in parallel to each other in one direction.

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

A display device includes a display panel including a light emitting region and a peripheral region adjacent to the light emitting region; an organic layer disposed on the display panel and having an opening that overlaps the light emitting region; and an adhesive layer disposed on the organic layer. The adhesive layer includes a first adhesive layer including a first base resin and having a first refractive index; and a second adhesive layer disposed on the first adhesive layer and having a second refractive index less than the first refractive index.

Highly Dieelectric Metal Oxide Filled Polymers for Radio Frequency Products

Multi-layered articles or products comprising layers of filled polymer compositions, methods of making and applications or uses thereof.

POLYMER FILM AND LAMINATE
20230070617 · 2023-03-09 · ·

An object of the present invention is to provide a polymer film having a low dielectric loss tangent and a small difference in a linear expansion coefficient from that of a copper foil; and a laminate.

The polymer film of an embodiment of the present invention is a polymer film including a liquid crystal polymer, in which a hardness A at a distance of half of a thickness of the polymer film and a hardness B at a distance of 1/10 of the thickness of the polymer film satisfy a relationship of Expression (1A), and in a case where positions at distances of 1/10, 4/10, and 6/10 of the thickness of the polymer film are defined as a position T1, a position T2, and a position T3, respectively; and a region from the one surface to the position T1 is defined as a first surface layer region, and a region from the position T2 to the position T3 is defined as a central region, a void area proportion X in the first surface layer region and a void area proportion Y in the central region satisfy a relationship of Expression (2A).

[00001]Hardness A + Hardness B/20.10GPa

[00002]Void area proportion Y - Void area proportion X0.10%

ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND MANUFACTURING METHOD OF STRUCTURE
20230111471 · 2023-04-13 ·

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

Plastic intermediate film, laminate including same, and mobility means including same
11648756 · 2023-05-16 · ·

The plastic intermediate film includes a sound insulating layer, wherein the sound insulating layer comprises a polyvinyl acetal resin, a plasticizer, and a refractive index regulator, wherein the refractive index regulator is particles with average diameter (D.sub.50) of 100 nm or less and has an absolute refractive index of 2.0 or more, wherein the refractive index regulator is comprised in an amount of more than 0 wt % and 1 wt % or less based on the entire sound insulating layer, and wherein the plasticizer is comprised in an amount of 33 to 41 wt % based on the entire sound insulating layer.