Patent classifications
B32B2264/1055
RESIN COATED COPPER AND CIRCUIT BOARD INCLUDING THE SAME
A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.
ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION
An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
Lightning strike protection surfacer and method of manufacturing the same
A thermoplastic surfacer for providing lightning strike protection to a composite component of an aircraft, methods of manufacturing the surfacer, and methods of applying the surfacer to a composite part. The thermoplastic surfacer includes a broadgood having a thermoplastic resin, one or more fillers embedded into the broadgood, and a lightning strike protection mesh or foil embedded into the broadgood. When applying the surfacer to a composite part of an aircraft, the method includes draping the surfacer on an at least partially unconsolidated composite part, consolidating the at least partially unconsolidated composite part by heating the part to a temperature at or above a melt temperature of a resins used in the part and in the surfacer, and filling at least one surface defect in the consolidated part using the thermoplastic polymer resin and milled fibers provided in the thermoplastic surfacer.
ENCAPSULATION FILM
An encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same are provided, where the encapsulation film allows forming a structure capable of blocking moisture or oxygen penetrating into an organic electronic device from outside and prevents generation of bright spots in the organic electronic device.
Lightning strike protection surfacer and method of manufacturing the same
A thermoplastic surfacer for providing lightning strike protection to a composite component of an aircraft, methods of manufacturing the surfacer, and methods of applying the surfacer to a composite part. The thermoplastic surfacer includes a broadgood having an amorphous thermoplastic resin, one or more fillers embedded into the broadgood, and a lightning strike protection mesh or foil embedded into the broadgood. When applying the surfacer to a composite part of an aircraft, the method includes draping the surfacer on an at least partially unconsolidated composite part, consolidating the at least partially unconsolidated composite part by heating the part to a temperature at or above a melt temperature of a resins used in the part and in the surfacer, and filling at least one surface defect in the consolidated part using the amorphous thermoplastic polymer resin and milled fibers provided in the thermoplastic surfacer.
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.
LIGHTNING STRIKE PROTECTION SURFACER AND METHOD OF MANUFACTURING THE SAME
A thermoplastic surfacer for providing lightning strike protection to a composite component of an aircraft, methods of manufacturing the surfacer, and methods of applying the surfacer to a composite part. The thermoplastic surfacer includes a broadgood having a thermoplastic resin, one or more fillers embedded into the broadgood, and a lightning strike protection mesh or foil embedded into the broadgood. When applying the surfacer to a composite part of an aircraft, the method includes draping the surfacer on an at least partially unconsolidated composite part, consolidating the at least partially unconsolidated composite part by heating the part to a temperature at or above a melt temperature of a resins used in the part and in the surfacer, and filling at least one surface defect in the consolidated part using the thermoplastic polymer resin and milled fibers provided in the thermoplastic surfacer.
Heat-conductive sheet
A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.
ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME
An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.
Structural arrangement with a fiber reinforced polymer component and a cold gas sprayed electrically conductive layer
A structural arrangement comprising a fiber reinforced polymer component, a cold gas spraying electrically conductive layer, and a polyether sulfone foil arranged on the fiber reinforced polymer component, at least in a region between the fiber reinforced polymer component and the cold gas sprayed electrically conductive layer.