Patent classifications
B32B2264/503
LAMINATE STRUCTURE
A laminate structure is disclosed including a fibre laminate impregnated with a laminate matrix material, and a veil of carbon nanotubes impregnated with a veil matrix material. The laminate matrix material and the veil matrix material doped with carbon particles. The veil provides lightning strike protection. The structure is manufactured by co-curing the laminate matrix material and the veil matrix material to bond the veil of carbon nanotubes to the fibre laminate.
Heat-conductive sheet
A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.
POLYMER MEMBER/INORGANIC BASE COMPOSITE, PRODUCTION METHOD THEREFOR, AND POLYMER MEMBER THEREFOR
A composite of polymer member and inorganic substrate, a method of manufacturing the same, and a polymer member therefor are provided. A method for manufacturing a composite 210, 220 of polymer member and inorganic substrate includes: providing a composite 110, 120 of thermally modified polymer layer and inorganic substrate in which one or more thermally modified polymer layers 20, 21, 22 are adhered onto an inorganic substrate 10, and bonding a polymer member 30, 31, 32 to the inorganic substrate via the one or more thermally modified polymer layers 20, 21, 22.
SEALANT FILM
The present invention provides a film and/or a packaging bag from which contents that may be viscous are easily brought out, and exhibiting enough heat seal properties as well as superior anti-blocking effect and slipperiness. The sealant film has a seal layer consisting of a resin composition including the following (a) and (b), and the film satisfies the following (1) to (3). (a) Polyolefin-based resin; and (b) Silylated polyolefin resin, (1) An abundance ratio (Si/C) of silicon atoms Si to carbon atoms C included in the seal layer of 0.001 or more and 0.02 or less; (2) An abundance ratio (Si/C) of silicon atoms Si to carbon atoms C present at a surface of the seal layer of 0.05 or more and 0.2 or less; and (3) An arithmetic average roughness Ra of a surface of the seal layer of 0.1 μm or more and 0.5 μm or less
Anisotropic conductive film (ACF) structure and hot-pressing method and hot-pressing assembly thereof
An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.
Insulating sheet and laminate
Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
Insulating sheet and laminate
Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
ANISOTROPIC CONDUCTIVE FILM (ACF) STRUCTURE AND HOT-PRESSING METHOD AND HOT-PRESSING ASSEMBLY THEREOF
An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.
HEAT-CONDUCTIVE SHEET
A heat-conducting sheet 1 comprising a first heat-conducting layer 1a and a second heat-conducting layer 1b, which each comprise a polymer matrix 2 and an anisotropic filler 3, and wherein the anisotropic filler is oriented in a thickness direction. The first and second heat-conducting layers 1a and 1b are laminated via an interface 5 in which a filling ratio of the anisotropic filler 3 is lower than that of the first and second heat-conducting layers 1a and 1b.
RECYCLABLE OR COMPOSTABLE FILM REPLACEMENTS OF PLASTIC ALUMINUM LAMINATE PACKAGING
The invention describes the use of magnetic platelet particles as a multifunctional additive to various formulations of polyolefin plastic films usable to fabricate packaging and to provide said packaging with similar barrier properties as aluminium metallizations or other gas barriers, with the added benefit of allowing separation and recovery of the packaging by magnetic means. Such novel additives, films and packaging are environmentally friendly and food-safe, so that after use they can be either recovered for reuse, composted, or dumped in the environment to biodegrade. The invention comprises various types of films comprising the additive and methods to improve the properties of said films.