A resin sheet having: a surface layer having hair-like bodies arranged regularly on one surface thereof; and a second layer directly laminated to a surface opposite that of the hair-like bodies of the surface layer, the surface layer comprising a thermoplastic polyurethane resin and the second layer comprising a polymer alloy resin of a polycarbonate-based resin and a polyester-based and resin.

The invention provides a cover tape and the method for manufacturing the same. The cover tape comprises an antistatic layer, two intermediate layers, a base layer, two tie layers and a heat seal layer. These seven layers are formed by a co-extrusion process.

The invention relates to plastic films and a silicone containing polymer blend composition that can be used in the production of the plastic films which is a polymer composition obtainable from, per 100 parts by weight of the composition, 99.99 to 90 parts by weight of a polyolefin polymer (P) and 0.01 to 10 parts by weight of a masterbatch (M).

A composite cooling film including non-fluorinated organic polymeric layer, a metal layer disposed inwardly of the non-fluorinated organic polymeric layer, and an antisoiling, ultraviolet-absorbing hardcoat layer that is disposed outwardly of the non-fluorinated organic polymeric layer.

A direct-to-consumer heat shrunk bundled product made up of a plurality of paper product rolls each individually packaged by a first package material and arranged relative to one another so as to form a bundle, the bundle being packaged by a second package material, wherein a substantial portion of the inner surface of the second package material is in contact with the first package material of the plurality of paper product rolls and is nonstick relative to the first package material. The bundle includes fused end seals so that the bundle does not include open gussets that might otherwise catch on machinery during sorting and shipping. The packaging material and/or wrapper may include laser energy absorbing material or adhesive.

A composition comprising an ethylene/CO interpolymer, formed from a high pressure, free-radical polymerization, and wherein the ethylene/CO interpolymer has the following properties: a) a CO content from “greater than 0” weight percent to less than, or equal to, 10 weight percent CO (carbon monoxide), based on the weight of the interpolymer; and b) a melting point, Tm, in ° C. that meets the following relationship: Tm (° C.)≤601.4*(Density in g/cc)−452.5(° C.).

A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of −20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.

A white polyester film is described that includes at least a layer including, as a main component, a polyester resin (A), a thermoplastic resin (B) incompatible with the polyester resin (A), and an inorganic particle (C), where the white polyester film achieves high reflectance and a concealing property without increasing the thickness of the reflective film, the layer including voids in which the thermoplastic resin (B) functions as nuclei, wherein in a vertical section of the white film, NB2/NB1×100 (%) is 15% or more, wherein NB1 represents the number of the nuclei of the thermoplastic resin (B), and NB2 represents the number of the sections of the thermoplastic resin (B), the sections including the inorganic particle (C) inside.

This invention relates to a biodegradable film which is particularly suitable for the manufacture of packaging and is also characterised by high level mechanical properties.

A cover tape for packing an electronic component includes: a substrate layer; a heat sealing layer placed on one surface side of the substrate layer; and an intermediate layer placed between the substrate layer and the heat sealing layer, and a transmitted image definition based on JIS K 7374, with an optical comb width set to 0.5 mm, is 30% or more.