A cap for capping an upper surface of a shoe a first layer, a second layer, and a third layer. The first layer has an outer surface that has a coefficient of friction that is greater than that of the upper surface of the shoe that that the cap caps. The second layer is an adhesive layer. Third layer is a release layer that can be peeled off the adhesive layer to expose it, thereby enabling said adhesive layer to stick to said shoe.

A condensation management apparatus comprises a microstructured film arranged to condense water vapor on an underside of a substantially horizontal surface. The film comprises channels disposed at least on a first major surface and configured to support capillary movement of condensate. The channels have a channel axis substantially parallel with a longitudinal axis of the film. A capillary siphon structure of the film comprises a fold in the film, a condensate collection region proximate the fold, and a siphon region between the fold and a condensate release location of the film. At least a portion of a second major surface is attached to the underside of the substantially horizontal surface such that longitudinal openings of the channels of the condensate collection region are oriented towards a direction of gravity and the condensate release location is positioned lower along the direction of gravity than the condensate collection region.

The present invention relates to fiber composite plastic (11, 13) comprising a polymer (40, 41) and at least one textile (50), which has at least one palpably inhomogeneous surface (60, 61) with a textile structure and is entirely surrounded by polymer (40, 41), wherein the fiber composite plastic (11, 13) has at least one palpably inhomogeneous surface (60, 61), wherein inhomogeneities of this fiber composite plastic surface are caused by the textile structure, and a method for producing the fiber composite plastic (11, 13).

A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

A multi-ply tissue paper product includes at least three plies. The tissue paper product includes a first inner ply being a creped ribbed ply and having a basis weight of 10 to 30 gsm, and a first outermost ply and a second outermost ply on each side of said inner ply, the first and second outermost plies being non-ribbed plies, wherein a creped ribbed ply is a ply including ribs and valleys providing an average core roughness Rk in the range 10 to 300 μm, and peaks being 4 to 12 per cm as measured along said first direction; and wherein a non-ribbed ply is a ply displaying no parallel ribs and valleys extending continuously along any direction of the ply or displaying parallel ribs and valleys extending continuously along any direction of the ply, the ribs and valleys providing peaks being less than 4 per cm.

The invention provides a sealant film that is less likely to adsorb components formed of various types of organic compounds, has excellent heat sealing characteristics at 140° C., while having low heat sealing strength at 100° C. and being less likely for heat sealing layers to adhere to each other even when the film is used as a packaging bag and the content thereof is warmed in boiling water. The sealant film has at least one heat sealing layer consisting of a polyester component, wherein a heat sealing strength of the heat sealing layer being heat sealed to another heat sealing layer at 100° C. and 0.2 MPa for 2 seconds is 0-5 N/15 mm and at 140° C. and 0.2 MPa for 2 seconds is 8-30 N/15 mm, and a film density including all layers is 1.20 or more and less than 1.39.

The present disclosure is directed to a physically crosslinked, closed cell continuous multilayer foam structure comprising at least one foam polypropylene/polyethylene layer with a KEE cap layer. The multilayer foam structure can be obtained by coextruding a multilayer structure comprising at least one foam layer composition layer with at least one cap layer composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

The present disclosure is directed to a physically crosslinked, closed cell continuous multilayer foam structure comprising at least one foam polypropylene/polyethylene layer with a KEE cap layer. The multilayer foam structure can be obtained by coextruding a multilayer structure comprising at least one foam layer composition layer with at least one cap layer composition layer, irradiating the coextruded structure with ionizing radiation, and continuously foaming the irradiated structure.

An enhanced, co-formed fibrous web structure is disclosed. The web structure may have a co-formed core layer sandwiched between two scrim layers. The core layer may be formed of a blend of cellulose pulp fibers and melt spun filaments. The scrim layers may be formed of melt spun filaments, and the filaments forming one or both scrim layers may have a number average diameter of 4.5 μm or less. Filaments of one or both of the scrim layers, and optionally the core layer, may also be meltblown filaments. Alternatively, the filaments forming the scrim layers may constitute from 1 to 13 percent of the weight of the structure. Alternatively, the scrim layers may have a combined basis weight of from 0.1 gsm to less than 3.0 gsm. A method for forming the structure, including direct formation of layers, is also disclosed.