A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.

A method for recovering a resource from a CIGS thin-film solar cell to be recycled includes a) providing the CIGS thin-film solar cell, and b) subjecting the CIGS thin-film solar cell to a cooling treatment at a predetermined temperature, such that a light absorbing unit of the CIGS thin-film solar cell can be recovered due to thermal strain difference of materials of the CIGS thin-film solar cell.

A method for recovering a resource from a CIGS thin-film solar cell to be recycled includes a) providing the CIGS thin-film solar cell, and b) subjecting the CIGS thin-film solar cell to a cooling treatment at a predetermined temperature, such that a light absorbing unit of the CIGS thin-film solar cell can be recovered due to thermal strain difference of materials of the CIGS thin-film solar cell.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

Hydroentangled composites having a wide variety of uses (e.g., personal hygiene articles, facers for fenestration absorbent patches on surgical drapes, facers on absorbent surgical drapes, etc.) are provided. The hydroentangled composite includes at least two nonwoven webs hydroentangled together. The hydroentangled composite may have a three-dimensional structure. Additionally, the at least two nonwoven webs may have different bonding levels and/or lint levels.

A jig for laminate production for producing a laminate of an electrode for electrolysis and a membrane, the jig containing: a roll for electrode around which an elongate electrode for electrolysis is wound, and a roll for membrane around which an elongate membrane is wound.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

Hydroentangled composites having a wide variety of uses (e.g., personal hygiene articles, facers for fenestration absorbent patches on surgical drapes, facers on absorbent surgical drapes, etc.) are provided. The hydroentangled composite includes at least two nonwoven webs hydroentangled together. The hydroentangled composite may have a three-dimensional structure. Additionally, the at least two nonwoven webs may have different bonding levels and/or lint levels.

Interfacial delamination processes for physically separating a film structure from a substrate, and processes of fabricating a thin-film electronic device. The processes entail providing the substrate with an electrically-conductive separation layer on a surface of the substrate and optionally providing a pin hole free barrier layer on the electrically-conductive separation layer, forming a film structure on the electrically-conductive separation layer or, if present, the barrier layer, to yield a multilayer structure, and separating the film structure from the substrate by subjecting the multilayer structure to interfacial debonding that comprises contacting at least an interface between the film structure and the electrically-conductive separation layer or, if present, the barrier layer, with water or an electrolyte solution.