Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane). The adhesion of the substrate to the material through the bonding layer can include chemical bonds such as, but not limited to, siloxane linkages, silanol linkages, silyl linkages, or any combination thereof in the bonding layer.

A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.

Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane). The adhesion of the substrate to the material through the bonding layer can include chemical bonds such as, but not limited to, siloxane linkages, silanol linkages, silyl linkages, or any combination thereof in the bonding layer.

A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.

A composite foam article is disclosed herein. The composite foam article comprises a polyurethane foam core presenting a first surface and a second surface facing opposite the first surface. A first skin is disposed on the first surface and a second skin is disposed on the second surface. The polyurethane foam core has a density of 15-80 kg/m.sup.3. The first and second skins comprise a plurality of fibers and a polymeric binder. The composite foam article has a weight per unit area of 500-1000 g/m.sup.2 and a strength of greater than 17 N at a post-compression thickness of greater than 2 mm when tested in according with SAE J949 at 23° C.

A composite material formed by combining a polyurethane material with an unclickable foam layer and a scrim layer through roll and flat form technology. The composite material is embossed to form pillowlike chambers or cells delineated by a network of emboss pattern lines formed by the bonding between these layers.

A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.

The present disclosure provides, among other things, surface coverings with a protective coat applied thereto a rubber material. As provided herein, in some embodiments, a surface covering has or includes an exposed surface that is no-wax. The present disclosure further provides methods of making, and methods of using. Such surface coverings have surprising and beneficial attributes. They are particularly advantageous as resistant to soiling and abrasion. These surface covering are also resistant to crumbling under load. Such surface coverings would be useful as flooring products with desirable properties. In particular, such abrasion and soil resistant surfaces could be useful as a rubber flooring product.

The invention relates to a polyolefin film comprising at least five layers: a core layer (a), comprising a polyolefin; an outer supporting layer (b), comprising copolymers of ethylene and propylene; an inner supporting layer (c), on the face of the core layer opposite to the outer supporting layer, comprising a polyolefin; a first coating layer (d) immediately in contact with the inner supporting layer (c), and finally a second coating layer (e) immediately in contact with the inner supporting layer (c), both comprising copolymers of ethylene with one or several polar monomers. In addition, the present invention relates to the process of manufacturing said polyolefin film and also the uses thereof for coating a substrate.

Interfacial delamination processes for physically separating a film structure from a substrate, and processes of fabricating a thin-film electronic device. The processes entail providing the substrate with an electrically-conductive separation layer on a surface of the substrate and optionally providing a pin hole free barrier layer on the electrically-conductive separation layer, forming a film structure on the electrically-conductive separation layer or, if present, the barrier layer, to yield a multilayer structure, and separating the film structure from the substrate by subjecting the multilayer structure to interfacial debonding that comprises contacting at least an interface between the film structure and the electrically-conductive separation layer or, if present, the barrier layer, with water or an electrolyte solution.