Patent classifications
B32B2310/0812
Heat bonding of low energy surface substrates
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
Induction curing of cell-based structural arrays
Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.
Skin-foam-substrate structure via induction heating
A method of forming a skin-foam-substrate type structure particular suitable as an automobile trim component. The method comprises supplying a polymer resin containing a chemical foaming agent and including metal particles capable of inductive heating, that is positioned between a polymeric skin and substrate, followed by inductive heating to cause foaming of the polymeric resin. The foamed polymer resin adheres to the skin and substrate.
System and method for producing a heat-sealable composite liquid impervious, moisture-eliminating membrane with a metallic antimicrobial surface treatment
A system and method for producing a heat-sealable composite liquid impervious, moisture-eliminating membrane with a metallic antimicrobial surface treatment including a compatibilized thermoplastic laminate structure, an integral inductive-welding element, and a metallic antimicrobial surface treatment. The method is provided with at least one scrim, a film exudate, a quantity of primary adhesive, at least one susceptor, and a quantity of flocking material, wherein the scrim, film exudate, and flocking material are composed of a compatibilized thermoplastic compound. The method is further provided with an optional metallic slurry, defining a thermoplastic-particulate emulsion configured to coat and embed into a subjected membrane section and fibrous materials when exposed to heat. The method is further expanded to apply to extant installations of similar membrane sections, enabling to post-manufacture surface treatment of a surface with the metallic slurry to confer manifold antimicrobial benefits to said surface.
Induction Curing of Cell-Based Structural Arrays
Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.
Thermo induction press for welding printed circuits and method carried out thereof
The invention regards a press for soldering multilayer stacks for printed circuits, with an outer muffle that encloses soldering chambers where multilayer stacks are arranged to be heated, inducing a magnetic flux. For such purpose, the press is provided with an inductor having winding form which is arranged on a mobile piston adapted to apply a force on the multilayer stack, such to generate a magnetic flux at its interior that is spatially uniform and regular over time.
Label laminate and a method and a system for manufacturing a label laminate
The invention relates to a method for manufacturing a label laminate. The method includes forming at least one water based adhesive layer on a belt, drying said at least one water based adhesive layer on the belt, unwinding a first material layer, unwinding a second material layer, attaching said at least one dried water based adhesive layer to the surface of the first material layer, and laminating the first material layer comprising at least one water based adhesive layer together with the second material layer in order to form the label laminate. The invention also relates to a label laminate and to a system for manufacturing a label laminate.
Assembly and method to repair thermoplastic composites
An assembly to repair a thermoplastic composite. The assembly includes a heating device positioned on opposing sides of the thermoplastic composite. The heating device includes one or more susceptor with a Curie temperature to heat the thermoplastic composite. A pressure device applies a compressive force to the heating device. A pressure distribution device is positioned between the heating device and the thermoplastic composite. The pressure distribution device distributes the compressive force from the pressure device over areas of the opposing sides of thermoplastic composite.
System and Method for Producing a Heat-sealable Composite Liquid Impervious, Moisture-Eliminating Membrane with a Metallic Antimicrobial Surface Treatment
A system and method for producing a heat-sealable composite liquid impervious, moisture-eliminating membrane with a metallic antimicrobial surface treatment including a compatibilized thermoplastic laminate structure, an integral inductive-welding element, and a metallic antimicrobial surface treatment. The method is provided with at least one scrim, a film exudate, a quantity of primary adhesive, at least one susceptor, and a quantity of flocking material, wherein the scrim, film exudate, and flocking material are composed of a compatibilized thermoplastic compound. The method is further provided with an optional metallic slurry, defining a thermoplastic-particulate emulsion configured to coat and embed into a subjected membrane section and fibrous materials when exposed to heat. The method is further expanded to apply to extant installations of similar membrane sections, enabling to post-manufacture surface treatment of a surface with the metallic slurry to confer manifold antimicrobial benefits to said surface.
HEAT BONDING OF LOW ENERGY SURFACE SUBSTRATES
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.