Patent classifications
B32B2310/0868
Heat bonding of low energy surface substrates
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
SYSTEM AND METHOD OF DIELECTRIC BONDING
A system and method for dielectric bonding including a dielectric heater having a pair of opposing electrode plates, a nest removably coupled to a first electrode plate of the pair of electrode plates, and an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates. The nest having a plurality of cooling channels defined in a body thereof in which a cooling fluid circulates to cool a material assembly that is supported by the nest. The interchangeable electrode assembly having a plurality of concentrator members that are configured to concentrate energy from a voltage source in predetermined locations on the material assembly.
Electrorheological fluid structure having strain relief element and method of fabrication
An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.
Apparatus and method for a temperature released adhesive structure for use with bandages
An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.
Electrorheological Fluid Structure Having Strain Relief Element and Method of Fabrication
An article may include a first polymeric material layer having a surface. A first conductive trace may form at least a portion of the first layer surface. The article may further include a second polymeric material layer. The second layer may have a first surface, a portion of the second layer first surface being bonded to a portion of the first layer surface. The second layer may have a portion of a channel defined therein, the channel at least partially coinciding with a portion of the first conductive trace. The article may also include a first patch interposed between the first layer surface and the second layer first surface. The first patch may span the channel and cover a portion of the first conductive trace.
APPARATUS AND METHOD FOR A TEMPERATURE RELEASED ADHESIVE STRUCTURE FOR USE WITH BANDAGES
An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.
SYSTEMS AND METHODS FOR MANUFACTURING ACOUSTIC PANELS
The present disclosure relates to methods of manufacturing an acoustic absorption system. The acoustic absorption system can include a curtain that includes one or more insulating or acoustic absorption sheets. The manufacturing method uses press welding to seal the insulating sheets between a first layer of material and a second layer of material. Each insulating sheets is disposed within a corresponding compartment of the acoustic absorption system and an entire perimeter of each compartment can be sealed simultaneously, wherein the seals form a plurality of panels.
FLOOR AND WALL MAT AND METHOD OF MAKING THE SAME
A method of manufacturing a mat is provided. The method involves securing a first layer formed of a polymer within a base die, positioning an intermediate cushion layer on top of the first layer, securing a second layer formed of the polymer to the base die, and securing a perimeter of the first layer to a perimeter of the second layer by radio-frequency welding, so as to envelop the intermediate cushion layer within the first and second layers and thereby form the mat. The first layer has a first surface and an opposing second surface in contact with the base die. The intermediate cushion layer has a first surface and an opposing second surface in contact with the first surface of the first layer. The second layer has a first surface and an opposing second surface in contact with the first surface of the intermediate cushion layer.
WOUND-CONNECTION PADS FOR FLUID INSTILLATION AND NEGATIVE PRESSURE WOUND THERAPY, AND SYSTEMS AND METHODS
Connection pads for coupling fluid-instillation and negative pressure wound therapy (NPWT) apparatuses to wound dressing, and methods and wound dressings for breaching a drape after coupling a wound dressing to a fluid-instillation and/or NPWT apparatus.
APPARATUS AND METHOD FOR A TEMPERATURE RELEASED ADHESIVE STRUCTURE FOR USE WITH BANDAGES
An adhesive article that remains securely bonded to a substrate until a stimuli is applied. The article may be embodied as an adhesive tape, a bandage, or as other articles. The stimuli may be a change in temperature or application of a reduction that causes a structure within the article to break, creak, or otherwise disrupt to expose the adhesive to a solvent, such as via a difference in Coefficient of Thermal Expansion (CTE) or by exposing the article to a glass transition temperature.