The present disclosure relates to a spatio-temporal stimulus responsive foldable structure. The structure may have a substrate having at least a region formed to provide engineered weakness to help facilitate bending or folding of the substrate about the region of engineered weakness. The substrate is formed to have a first shape. A stimulus responsive polymer (SRP) flexure is disposed at the region of engineered weakness. The SRP flexure is responsive to a predetermined stimulus actuation signal to bend or fold in response to exposure to the stimulus actuation signal, to cause the substrate to assume a second shape different from the first shape.

The invention relates to a layered material, comprising a substrate and at least one layer A, wherein the at least one layer A comprises at least 50 wt % of a branched copolyester, wherein wt % is with respect to the total weight of layer A, and wherein the branched copolyester has a melting temperature of between 125° C. and 185° C., Mz/Mw of at least 3.5, and having a Melt Flow Index (MFI) of at most 10 g/10 min as measured at 190° C. with 2.16 kg. The invention also relates to a film comprising at least one layer A.

A polyimide film, a method of manufacturing the same, and a flexible metal foil clad laminate including the same. The polyimide film includes: a first imide bond unit having a glass transition temperature of 400° C. or higher; and a second imide bond unit having a glass transition temperature of less than 400° C., wherein the first imide bond unit is present in an amount of about 39 mol% to about 90 mol% in the polyimide film.

The present invention is directed to the production of stretchable wrinkled film electrodes for use in wearable/portable ROC systems using electrochemical analysis techniques. A polymer layer is disposed on a conductive substrate and a sacrificial layer is disposed on said polymer layer. An electrode shape template is cut out of adhesive and disposed on the sacrificial layer. A metallic film is disposed on the sacrificial layer by the electrode shape template. The disposed layers are removed from the conductive substrate and placed in an oven to allow said layers to shrink. The shrunken metallic film is treated with a solution to promote bonding between the film and an elastomer. The elastomer is drop-cast onto the shrunken film and the sacrificial layer is dissolved to detach the shrunken polymer layer. The shrunken film and elastomer are placed in a chemical bath and dried, producing the stretchable wrinkled film electrode.

A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

It is provided an airbag multilayer complex excellent in flexibility and durability by controlling adhesion between an adhesive layer and a base fabric to a predetermined range, and an airbag using it. This disclosure is an airbag multilayer complex comprising a base fabric and a multilayer film including an outer layer and an adhesive layer that is bonded to one surface of the base fabric. The adhesive strength of the interface between the multilayer film and the base fabric is 5 N/cm or more, the difference in loop stiffness between the airbag multilayer complex and the base fabric is 130 mN/cm or less, the adhesive layer contains a first resin having a hydrogen-bonding capacity, and the difference in Hansen solubility parameter (ΔHSP) between the base fabric and the first resin is 5 MPa.sup.0.5 or less.

A dental appliance for positioning a patient's teeth includes a removable orthodontic tooth positioning appliance having teeth receiving cavities shaped to directly receive at least some of the patient's teeth and apply a resilient positioning force to the patient's teeth. The appliance includes a hard polymer layer having a hard polymer layer elastic modulus disposed between a first soft polymer layer having a first soft polymer layer elastic modulus and a second soft polymer layer having a second soft polymer layer elastic modulus. The hard polymer layer elastic modulus is greater than each of the first soft polymer layer elastic modulus and the second soft polymer layer elastic modulus. At least one of the first soft polymer layer and the second soft polymer layer has a flexural modulus of greater than about 35,000 psi.

Forming systems and assemblies as disclosed herein comprise a composite material comprising a structural component and a resin component combined with the reinforcing component. A forming element is disposed within the composite material and has a coefficient of thermal expansion that is greater than that of the composite material. The forming element is positioned to provide a desired integral structural reinforcement and/or surface feature to the composite. The composite material may comprise one or more passages extending from a surface thereof to the forming element. The composite material may be cured by heat to take a set configuration and then allowed to cool. The cooling of the composite material and the forming element enables the forming element to contract relative to the composite material and become delaminated therefrom to facilitate easy removal, and thereby provide an improved method and assembly for making structural reinforcing features in composite structures.

Forming systems and assemblies as disclosed herein comprise a composite material comprising a structural component and a resin component combined with the reinforcing component. A forming element is disposed within the composite material and has a coefficient of thermal expansion that is greater than that of the composite material. The forming element is positioned to provide a desired integral structural reinforcement and/or surface feature to the composite. The composite material may comprise one or more passages extending from a surface thereof to the forming element. The composite material may be cured by heat to take a set configuration and then allowed to cool. The cooling of the composite material and the forming element enables the forming element to contract relative to the composite material and become delaminated therefrom to facilitate easy removal, and thereby provide an improved method and assembly for making structural reinforcing features in composite structures.

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.