A vehicle cargo construct includes a floor, a plurality of side wall panels extending from the floor, and an end wall panel extending from the floor between the plurality of side wall panels. The floor has an upper surface and an oppositely opposed lower surface. Each of the plurality of side wall panels has an exterior surface and an oppositely opposed interior surface. The end wall panel has an exterior surface and an oppositely opposed interior surface. Each of the floor, the plurality of side wall panels, and the end wall panel being formed of a composite sandwich panel material formed of an open area core defining a plurality of pores, a surface sheet adhered to a first face of the open area core by a first adhesive layer, and a structural skin adhered to a second face of the open area core by a second adhesive layer.

A moisture-curing polyurethane composition including (i) at least one linear polymer P1 containing isocyanate groups and having an NCO content in range from 0.3%-3.3% by weight, obtained from reaction of at least one monomeric aromatic diisocyanate and polyether diol having an OH number in range from 5-37 mg KOH/g, (ii) at least one branched polymer P2 containing isocyanate groups and having an NCO content in range from 1%-10% by weight, obtained from reaction of at least one monomeric aromatic diisocyanate and at least one polyether triol having an average OH functionality of at least 2.2 and OH number in range from 16-380 mg KOH/g, (iii) and a content of plasticizers of not more than 15% by weight, based on overall composition, wherein polymers P1 and P2 are present in weight ratio in range from 80/20-95/5, and to the use of composition as elastic adhesive or elastic sealant or elastic coating.

A moisture-curing polyurethane composition including (i) at least one linear polymer P1 containing isocyanate groups and having an NCO content in range from 0.3%-3.3% by weight, obtained from reaction of at least one monomeric aromatic diisocyanate and polyether diol having an OH number in range from 5-37 mg KOH/g, (ii) at least one branched polymer P2 containing isocyanate groups and having an NCO content in range from 1%-10% by weight, obtained from reaction of at least one monomeric aromatic diisocyanate and at least one polyether triol having an average OH functionality of at least 2.2 and OH number in range from 16-380 mg KOH/g, (iii) and a content of plasticizers of not more than 15% by weight, based on overall composition, wherein polymers P1 and P2 are present in weight ratio in range from 80/20-95/5, and to the use of composition as elastic adhesive or elastic sealant or elastic coating.

An acoustic structure presenting a front surface and a back surface is provided. The acoustic structure includes a support layer comprising the back surface, a honeycomb core comprising a thickness defined between a back and a front, and a plurality of walls that define a plurality of honeycomb cells, wherein the plurality of honeycomb cells extend through the thickness of the honeycomb core opening out toward at least the front, and wherein the back of the honeycomb core is affixed to the support layer, a mesh layer affixed to the front of the honeycomb core, and a knit fabric layer affixed to the mesh layer and conforming to the front surface of the acoustic structure.

A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

A condensation management apparatus comprises a microstructured film arranged to condense water vapor on an underside of a substantially horizontal surface. The film comprises channels disposed at least on a first major surface and configured to support capillary movement of condensate. The channels have a channel axis substantially parallel with a longitudinal axis of the film. A capillary siphon structure of the film comprises a fold in the film, a condensate collection region proximate the fold, and a siphon region between the fold and a condensate release location of the film. At least a portion of a second major surface is attached to the underside of the substantially horizontal surface such that longitudinal openings of the channels of the condensate collection region are oriented towards a direction of gravity and the condensate release location is positioned lower along the direction of gravity than the condensate collection region.

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Disclosed is a bonded assembly comprising at least: a first substrate, a second substrate, an intermediate deformation layer secured to the first substrate, the intermediate deformation layer comprising a material in which cavities are provided so that the intermediate deformation layer has a stiffness which is variable along a direction parallel to the intermediate deformation layer, an adhesive between the intermediate layer and the second substrate.

A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.