Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

A hot-pressing device and process for an ACF bonding structure are provided. The hot-pressing device includes a transfer module and a first mounting plate connected to the transfer module. A negative-pressure adsorption module, at least one positioning module, and a lifting module are arranged on the first mounting plate. Pressing modules with hot-pressing assemblies are arranged at four corners close to the first mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The present disclosure can quickly remove glue overflowing on a heat conduction element in the hot-pressing module by the cleaning module to ensure the surface flatness of a second part of the heat conduction element for hot-pressing and satisfactory resistance of an ACF connected to a substrate after hot-pressing.

The present invention is to provide a method for producing a laminate having excellent adhesion properties. An embodiment of the present invention is a method for producing a laminate, the method including: a step 1 of dry-treating a surface A of a plastic to obtain a dry-treated plastic having a surface B that has been dry-treated; a step 2 of wiping the surface B with a cleaning tool containing a composition for wiping, the composition containing at least one solvent selected from the group consisting of water and polar solvents, and a silane coupling agent, to obtain a cleaned plastic having a surface C that has been wiped with the cleaning tool; and a step 3 of applying at least one selected from the group consisting of adhesives and primers on the surface C to obtain a laminated body.

A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.

To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.

A method of forming a dry floor assembly includes cleaning an upper layer with methyl ethyl ketone (MEK) prior to bonding the upper layer to a carbon wicking layer. Said cleaning removes release agent from the upper layer. The method also includes bonding the upper layer to the carbon wicking layer after said cleaning.

A structural arrangement comprising a fiber reinforced polymer component, a cold gas spraying electrically conductive layer, and a polyether sulfone foil arranged on the fiber reinforced polymer component, at least in a region between the fiber reinforced polymer component and the cold gas sprayed electrically conductive layer.

A filler material is applied to a plurality of wood elements. The plurality of wood elements is bonded into a composite wood product, where the bonding includes delivering ultrasound energy to the plurality of wood elements. The ultrasound energy has a frequency within a frequency range of 10 kHz-20 MHz.

A computer keyboard is refurbished by applying to its keys stickers each bearing a character designating the action of a respective key. For application of the stickers to the keys, the stickers are configured and arranged on an application tape in a layout congruent with the layout of the keys by a digital scan of the keyboard. The stickers are temporarily attached to the application tape by a peelable adhesive and then permanently attached to the keys by a pressure-sensitive permanent adhesive.