A method of manufacturing method a battery includes the following steps. Step (A): causing, with the first separator and the second separator being stacked on each other, the first separator and the second separator to be suction-attached to a winding core and to be pressed against the winding core with a jig including a plurality of protrusions formed on a surface of the jig. Step (B): winding the first separator and the second separator onto the winding core.

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

The present invention relates to a method of applying a film to a body. In this respect, a film is first applied to and positioned at a transfer mold and the body to be film coated is introduced into the transfer mold to which the film to be attached is applied or the transfer mold to which the film to be attached is applied is introduced into the body to be film coated so that the film is located between the body and the transfer mold. In the further course, a vacuum is applied in a region between the body and the film and/or an excess pressure is applied in a region between the transfer mold and the film so that the film moves from the transfer mold onto the body. A particularly simple method that is fast to be carried out is thereby provided for applying a film to a surface.

A release film of a protective module for manufacturing a display device, includes a film layer including a first surface facing a protective panel which is attachable to a display panel of the display device, and a second surface opposite to the first surface; an embossed pattern layer protruding from the second surface of the film layer; and the embossed pattern layer including a plurality of intaglio portions arranged along the film layer.

An affixing method includes a pressing step of pressing a tape against a wafer with a tape affixing roller and pressing the wafer against a suction table with the tape affixing roller, an evacuating step of evacuating a vacuum chamber that houses the suction table and the tape affixing roller therein to create a vacuum in the vacuum chamber, and an affixing step of affixing the tape to the wafer with the tape affixing roller by causing the tape affixing roller to roll on the tape while the tape affixing roller is pressing the wafer.

A system for ultrasonic bonding of elastic includes a rotating roll. The rotating roll has an exterior surface. A removable shell layer is attached to the external surface. The removable shell layer includes one or more patterned segments. The patterned segments include a shell channels formed through the removable shell layer to form a pattern.

A apparatus for manufacturing a display device includes: a stage for supporting a display module including a display panel, a cover window, and a flexible printed circuit board; and an adsorption unit disposed at one side of the stage, the adsorption unit configured to be moved in a horizontal direction such that a distance between the stage and the adsorption unit is adjusted, wherein the adsorption unit is configured to adsorb and support the flexible printed circuit board connected to the display panel.

Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.

The disclosure relates to a device (e.g., a jig) for attaching a protective film for protecting a display included in a foldable electronic device from impact and scratching. A film attaching apparatus for attaching a film to an electronic device is provided. The film attaching apparatus includes a display, wherein the film attaching apparatus may include a main body including a base plate, a jig disposed on a base plate and configured to seat the electronic device thereon, a film suction-fixing part inclined at a predetermined angle with respect to the jig, and a roller module disposed on the base plate and including a roller slidable above the jig, wherein the film suction-fixing part may include two or more divided suction areas which are sequentially arranged to correspond to a moving direction of the roller module and configured to have different suction forces.