A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.

Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

A method of and system for removing a portion of a thermoplastic component is provided. The component includes a thermoplastic material having a melting temperature. The method includes: a) providing a glider that includes an electrically conductive material operable to produce thermal energy resulting from electrical resistance; b) heating a portion of the glider with electrical energy to a glider operating temperature that is equal or greater than the melting temperature; and c) removing the portion by engaging the component with the glider and translating one of the glider or the component relative to the other. The engagement of the glider and the component causes an amount of the thermoplastic material to melt, and the translation of the one of the glider or the component relative to the other removes the portion from the thermoplastic component.

A recording medium, including: an ink-receiving layer configured to receive an ink for inkjet recording; and a transparent sheet having a total luminous transmittance of 50% or more, wherein the recoding medium has a layered structure in which the transparent sheet and the ink-receiving layer are sequentially stacked, and the ink-receiving layer includes a gap-absorption-type ink-receiving layer including a composition including at least inorganic fine particles and polyvinyl alcohol having a weight-average polymerization degree of 2,000 or more and 5,000 or less and a saponification degree of 70 mol % or more and 90 mol % or less.

The present invention includes a tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of fed component supply tape made from carrier tape and cover tape so as to peel the cover tape from the carrier tape, enabling a component to be supplied from at a component supply position, wherein the peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed. Accordingly, cover tape is reliably peeled without damaging components, and changeover work on the leading end of the component supply tape is not required.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive, The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

Disclosed are a display device and a method for manufacturing a cover thereof. A method for manufacturing a cover of a display device comprises: (a) a step in which a BM printing layer is formed on the front surface of a transparent film, and a release film is attached thereto; (b) a step in which the release film is cut along the BM printing layer; (c) a step in which the release film attached to the front surface of the transparent film is removed; (d) a step in which an abrasion-resistant coating layer is formed on the front surface of the transparent film; and (e) a step in which the release film attached to the BM printing layer is removed.