B32B7/025

BEND INDUCIBLE SELF-FOLDING ORIGAMI FLEXURES AND MICROSYSTEMS
20230048543 · 2023-02-16 ·

The present disclosure relates to a spatio-temporal stimulus responsive foldable structure. The structure may have a substrate having at least a region formed to provide engineered weakness to help facilitate bending or folding of the substrate about the region of engineered weakness. The substrate is formed to have a first shape. A stimulus responsive polymer (SRP) flexure is disposed at the region of engineered weakness. The SRP flexure is responsive to a predetermined stimulus actuation signal to bend or fold in response to exposure to the stimulus actuation signal, to cause the substrate to assume a second shape different from the first shape.

BEND INDUCIBLE SELF-FOLDING ORIGAMI FLEXURES AND MICROSYSTEMS
20230048543 · 2023-02-16 ·

The present disclosure relates to a spatio-temporal stimulus responsive foldable structure. The structure may have a substrate having at least a region formed to provide engineered weakness to help facilitate bending or folding of the substrate about the region of engineered weakness. The substrate is formed to have a first shape. A stimulus responsive polymer (SRP) flexure is disposed at the region of engineered weakness. The SRP flexure is responsive to a predetermined stimulus actuation signal to bend or fold in response to exposure to the stimulus actuation signal, to cause the substrate to assume a second shape different from the first shape.

RUBBER RESIN MATERIAL WITH HIGH DIELECTRIC CONSTANT AND METAL SUBSTRATE WITH HIGH DIELECTRIC CONSTANT
20230047133 · 2023-02-16 ·

A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

THERMOSETTING THERMALLY CONDUCTIVE DIELECTRIC COMPOSITE
20230052719 · 2023-02-16 ·

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

THERMOSETTING THERMALLY CONDUCTIVE DIELECTRIC COMPOSITE
20230052719 · 2023-02-16 ·

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

Composite structures with embedded electrical grids
11577498 · 2023-02-14 · ·

A composite structure of a cargo body and a method of making the same are disclosed. The composite structure includes at least one electrical grid embedded within fiber-reinforced polymer (FRP) layers. The embedded electrical grid includes a plurality of conductive fibers and a plurality of insulating fibers integrated into a polymer matrix of the FRP layers. The embedded electrical grid may be used for power distribution, structural strengthening and stiffness, and/or puncture detection.

Composite aerostructure with integrated heating element

A heated composite structure and a method for forming a heated composite structure. The structure includes carbon fibers embedded within a thermoplastic matrix. The carbon fibers are connected with first and second electrodes that are configured to be connected with an electric source such that applying current to the electrodes causes current to flow through the embedded carbon fibers to provide resistive heating sufficient to heat the composite structure to impede formation of ice on the composite structure.

MEASUREMENT SYSTEM AND RADIO WAVE BLOCKING UNIT
20230042017 · 2023-02-09 · ·

Provided are a measurement system and a radio wave shielding member that include a radio wave absorber that has light transmittance and absorbs radio waves other than the radio waves to be measured, and thus is suitable for the measurement of radio wave properties.

The measurement system includes a measuring target device 11, a measuring device 12 that emits and/or receives radio waves to measure the measuring target device, and a radio wave absorber 10 that has light transmittance and absorbs radio waves in and above the millimeter wave band. The radio wave absorber includes a transparent support member 2 and a radio wave absorbing sheet 1 that is attached to one surface of the support member. The radio wave absorbing sheet includes a resistive film 3, a dielectric layer 4, and a radio wave shielding layer 5 which are stacked on top of each other and all of which have light transmittance. The radio wave absorber blocks and/or absorbs unwanted radio waves around the measuring target device.

JOINING STRUCTURE

A joining structure includes a first member, a second member of a material different from that of the first member, and a separation mechanism provided between the first member and the second member and that separates the first member and the second member from each other, wherein a resin is filled into the space between the edge of at least one member among the first member and the second member, and the other member.

Transparent conducting film laminate and processing method thereof
11710581 · 2023-07-25 · ·

Provided are a transparent conducting film laminate to which a curl generated during a heating step and after the heating step can be controlled, and a method for processing the same. A transparent conducting film laminate comprises a transparent conducting film 20 and a carrier film 10 stacked thereon, wherein the transparent conducting film 20 comprises a transparent resin film 3, transparent conducting layer 4, and an overcoat layer 5 stacked in this order, the transparent resin film 3 having a thickness T.sub.1 of 5 to 25 μm and being made of an amorphous cycloolefin-based resin, the carrier film 10 is releasably stacked on the other main face, the face opposite to the face having the transparent conducting layer 4, of the transparent resin film 3 with an adhesive agent layer 2 therebetween, and a protection film 1 has a thickness T.sub.2 which is 5 times or more of the thickness T.sub.1 of the transparent resin film 3 and is 150 μm or less, and is made of polyester having an aromatic ring in its molecular backbone.