A method for manufacturing a bonded substrate, the method includes: bonding a first mother substrate including a first substrate and a second mother substrate including a second substrate to form a bonded mother substrate; cutting off a part of the first mother substrate along a dividing line of the bonded mother substrate to form a cutoff portion; dividing the bonded mother substrate along the dividing line; separating a bonded substrate from the bonded mother substrate, the bonded substrate including the first substrate and the second substrate bonded to the first substrate; forming a contact terminal on an end portion of the first mother substrate, the contact terminal contactable with an external terminal; forming a communication path between the first mother substrate and the second mother substrate along the dividing line.

An inkjet printing device includes a stage; an inkjet head disposed above the stage and comprising nozzles through which ink is discharged, the ink including bipolar elements extending in a direction; an ink circulation part which supplies the ink to the inkjet head, and to which the ink remaining after being discharged from the inkjet head is supplied; and at least one sensing part disposed between the inkjet head and the ink circulation part and sensing a number of the bipolar elements that are discharged through the nozzles.

A print head drive circuit drives a print head including an ejecting portion ejecting a liquid in response to a drive signal propagating through a drive signal line and a storage portion storing ejecting portion-related information changing in accordance with use of the ejecting portion, in which processing of reading the ejecting portion-related information changing in accordance with the use from the storage portion is performed before the drive signal for ejecting the liquid from the ejecting portion is supplied to the print head.

A liquid discharge head to discharge a liquid includes a piezoelectric body, a first electrode layer disposed at least partly on the piezoelectric body in a stacking direction, and a first wiring disposed on the first electrode layer in the stacking direction, the first wiring being more likely to cause ion migration than the first electrode layer, in which the piezoelectric body, the first electrode layer, and the first wiring are stacked in the stacking direction. When a predetermined area on the piezoelectric body is a first area, and a predetermined area adjacent to the first area on the piezoelectric body is a second area, both the first wiring and the first electrode layer are disposed in the first area, and the first wiring is not disposed while the first electrode layer is disposed in the second area.

Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

A liquid ejecting head includes a first sidewall, a second sidewall, and head chips. The head chips are arranged side by side between the first sidewall and the second sidewall. Each of the head chips has nozzles configured to discharge a liquid. The first sidewall is formed by a portion of a holder from which the liquid is to be supplied to the head chips, whereas the second sidewall is formed by a portion of a fixed plate to which the head chips are fixed. The fixed plate has an aperture through which the nozzles are exposed.

The piezoelectric material has, when viewed in the stacking direction, a first region including a border between an end of the active portion and the non-active portion in an extending direction of the individual electrode, the piezoelectric material has a second region different from the first region, and the piezoelectric material in the first region is thicker than the piezoelectric material in the second region.

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.

A liquid ejecting head includes: a pressure chamber substrate; and a communication plate, in which the pressure chamber substrate includes a first pressure chamber that extends in a first direction and applies pressure to a liquid, and a first supply channel, and the communication plate includes a first communication channel that extends in a second direction intersecting with the first direction and communicates with the first supply channel, and a second supply channel that communicates with the first supply channel and the first pressure chamber.

A highly reliable multilayer structure element substrate according to an embodiment of this present invention comprises: an electrothermal transducer; a temperature detection element formed at a position where the temperature detection element at least partially overlaps the electrothermal transducer in a planar view of the element substrate; and a plurality of wirings connected to the temperature detection element, wherein the temperature detection element can detect temperatures in a plurality of regions when a plurality of different wirings out of the plurality of wirings are selected.