B41J2/1606

NOZZLE PLATE, INKJET HEAD, NOZZLE PLATE MANUFACTURING METHOD, AND INKJET HEAD MANUFACTURING METHOD
20230234354 · 2023-07-27 ·

There is provided a nozzle plate of an inkjet head, the nozzle plate including: a first surface that is bonded to an upper layer substrate by an adhesive; and a second surface in which an opening of a nozzle that ejects an ink is provided. A step is formed at an edge of the first surface.

Uniform print head surface coating

Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings. The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings. The remaining layer of the material on the surface is thus formed with a uniform thickness.

LIQUID DISCHARGING HEAD AND INK-JET APPARATUS

A liquid discharging head includes a nozzle configured to discharge liquid, a pressure chamber communicated with the nozzle, and an individual channel communicated with the pressure chamber through a narrow part. The liquid discharging head also includes a common channel communicated with the individual channel, an energy generation element configured to generate energy, and a diaphragm configured to convey the energy to the pressure chamber. A metal oxide film is formed at inner walls of the nozzle, the pressure chamber, the narrow part, the diaphragm, and the individual channel, and a hydroxyl group has come out from the metal oxide film.

LIQUID JETTING STRUCTURE, LIQUID JETTING HEAD, AND LIQUID JETTING DEVICE
20220388306 · 2022-12-08 · ·

Provided are a liquid jetting structure and its applications. The liquid jetting structure includes: a nozzle substrate on which a nozzle for jetting a liquid is formed; and a flow passage substrate on which a liquid flow passage communicating with the nozzle is formed, in which a first layer, a second layer, and a liquid-repellent layer are provided in this order on a jetting surface of the nozzle substrate, the first layer and the second layer are provided in this order on an inner wall of the liquid flow passage, the first layer is a layer containing at least one selected from the group consisting of tantalum oxide, zirconium oxide, titanium oxide, and hafnium oxide, and the second layer is a layer containing at least one selected from the group consisting of SiO.sub.2, SiC, SiN, SiCN, and SiON.

METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE HEAD

A method for manufacturing a liquid discharge head comprising: a substrate, a protective layer covering at least a part of the substrate, and a laminate member formed on the protective layer, wherein the method comprises steps of: forming the protective layer on at least a part of the substrate; forming the laminate member on the protective layer with a part of the protective layer exposed, the protective layer comprises at least Si and C, a content of oxygen in a bulk of the protective layer is less than 20 atomic % in terms of an element composition ratio, a modified layer with a content of oxygen of 20 atomic % or more in terms of an element composition ratio is present on a surface of the protective layer, and a thickness of the modified layer between the protective layer and the laminate member is 3.40 nm or less.

SUBSTRATE JOINED BODY
20220379606 · 2022-12-01 ·

A substrate joined body including: a first substrate; a second substrate; an organic film that comprises silicon and carbon and joins the first substrate and the second substrate; and a protective film that comprises an inorganic element and is formed over the organic film from at least a part of the surface of the first substrate and at least a part of the surface of the second substrate, wherein the protective film comprises a region in which the ratio of carbon to silicon based on atomic percentage is from 0.0 to 5.0 in a region within 50 nm in a thickness direction from a surface of the organic film on the protective film side, when the surface is measured by X-ray photoelectron spectroscopy.

Liquid ejection head and method for manufacturing the same
11584127 · 2023-02-21 · ·

A liquid ejection head has at least a structure including an ejection orifice forming member having an ejection orifice for ejecting a liquid and a flow path communicating with the ejection orifice and a flow path forming substrate having a liquid introduction flow path communicating with the flow path and supplying the liquid, and includes: a first titanium oxide film with a pure water contact angle of 40° or less; and a second titanium oxide film with a pure water contact angle of 70° or more, wherein the first titanium oxide film covers the structure including inner walls of the flow path and the liquid introduction flow path and is exposed in the flow path and the liquid introduction flow path, and the second titanium oxide film has a portion covering the first titanium oxide film in a vicinity of an opening end.

Method for manufacturing a fluid-ejection device with improved resonance frequency and fluid ejection velocity, and fluid-ejection device

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.

LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME
20230030043 · 2023-02-02 ·

A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.

Liquid discharge head and method for manufacturing liquid discharge head

A liquid discharge head including: a substrate having a liquid supply port; a flow channel forming member that is provided on the substrate and has discharge ports for discharging a liquid and a liquid flow channel that makes the liquid supply port and the discharge ports communicate with each other; and a support member that is provided on the substrate and arranged to be in contact with at least one surface of the flow channel forming member, with the one surface not being in contact with the liquid, wherein the flow channel forming member includes a cured product of a first photosensitive resin composition including a photosensitive resin, the support member includes a cured product of a second photosensitive resin composition including the epoxy resin A having a structure represented by formula (a1) or (a2) below in main chain structure: ##STR00001##
where, n.sub.1 and n.sub.2 represent integers of at least 2.